CYStech Electronics Corp.
SMC/DO-214AB Dimension
Spec. No. : C337SC
Issued Date : 2003.06.02
Revised Date :
Page No. : 3/3
Marking Code:
Device CSMC
520
Code
SS52
Device CSMC
560
Code
SS56
CSMC
530
SS53
CSMC
580
SS58
CSMC
540
SS54
CSMC
5100
S510
CSMC
550
SS55
SMC/DO-214AB Plastic
Surface Mounted Package
CYStek Package Code:SC
*:Typical
DIM
A
B
C
D
Inches
Min.
Max.
0.260
0.276
0.173
0.189
0.012(typ)
0.144
0.152
Millimeters
Min.
Max.
6.6
7.0
4.4
4.8
0.3(typ)
3.6
3.8
DIM
E
F
G
H
Inches
Min.
Max.
0.228
0.244
0.071
0.087
0.032(typ)
0.04(typ)
Millimeters
Min.
Max.
5.8
6.2
1.8
2.2
0.8(typ)
1.0(typ)
Notes :
1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
•
Lead : 42 Alloy ; solder plating
•
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
CSMC520-5100SC
CYStek Product Specification
CYSTEKEC [ CYSTECH ELECTONICS CORP. ]
