CYStech Electronics Corp.
SMC/DO-214AB Dimension
Spec. No. : C344SC
Issued Date : 2003.10.29
Revised Date :
Page No. : 3/3
Marking Code:
Device CSMC
301
Code
A31
Device CSMC
305
Code
A35
CSMC
302
A32
CSMC
306
A36
CSMC
303
A33
CSMC
307
A37
CSMC
304
A34
SMC/DO-214AB Plastic
Surface Mounted Package
CYStek Package Code: SC
*:Typical
DIM
A
B
C
D
Inches
Min.
Max.
0.260
0.276
0.173
0.189
0.012(typ)
0.144
0.152
Millimeters
Min.
Max.
6.6
7.0
4.4
4.8
0.3(typ)
3.6
3.8
DIM
E
F
G
H
Inches
Min.
Max.
0.228
0.244
0.071
0.087
0.032(typ)
0.04(typ)
Millimeters
Min.
Max.
5.8
6.2
1.8
2.2
0.8(typ)
1.0(typ)
Notes :
1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material :
•
Lead : 42 Alloy ; solder plating
•
Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
CSMC30XSC
CYStek Product Specification
CYSTEKEC [ CYSTECH ELECTONICS CORP. ]
