CYStech Electronics Corp.
DO-35(Glass) Dimension
Spec. No. : C326LC
Issued Date : 2003.05.20
Revised Date :
Page No. : 3/3
E
A
A
B
C
D
B
C
D
DO-35 glass package, CYStek package code: LC
*:Typical
DIM
A
B
C
Inches
Min.
Max.
φ0.0181 φ0.0220
0.9646 1.2811
0.1200 0.1700
Millimeters
Min.
Max.
φ0.46
φ0.56
24.50
32.54
3.05
4.20
DIM
D
E
Inches
Min.
Max.
0.9646 1.2811
φ0.0602 φ0.0787
Millimeters
Min.
Max.
24.50
32.54
φ1.53
φ2.00
Notes :
1.Controlling dimension : millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
CBZX55CXXLC series
CYStek Product Specification
CYSTEKEC [ CYSTECH ELECTONICS CORP. ]
