CYStech Electronics Corp.
TO-126 Dimension
D
A
B
1 2 3
G
C
I
Spec. No. : C853T3
Issued Date : 2004.07.14
Revised Date : 2004.09.02
Page No. : 5/5
E
J
K
M
Marking:
α
3
α
4
N2129
Style: Pin 1.Base 2.Collector 3.Emitter
F
H
L
α
1
α
2
3-Lead TO-126 Plastic Package
CYStek Package Code: T3
*: Typical
DIM
α1
α2
α3
α4
A
B
C
D
E
Inches
Min.
Max.
-
*3°
-
*3°
-
*3°
-
*3°
0.1500
0.1539
0.2752
0.2791
0.5315
0.6102
0.2854
0.3039
0.0374
0.0413
Millimeters
Min.
Max.
-
*3°
-
*3°
-
*3°
-
*3°
3.81
3.91
6.99
7.09
13.50
15.50
7.52
7.72
0.95
1.05
DIM
F
G
H
I
J
K
L
M
Inches
Min.
Max.
0.0280
0.0319
0.0480
0.0520
0.1709
0.1890
0.0950
0.1050
0.0450
0.0550
0.0450
0.0550
-
*0.0217
0.1378
0.1520
Millimeters
Min.
Max.
0.71
0.81
1.22
1.32
4.34
4.80
2.41
2.66
1.14
1.39
1.14
1.39
-
*0.55
3.50
3.86
Notes:
1.Controlling dimension: millimeters.
2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
3.If there is any question with packing specification or packing method, please contact your local CYStek sales office.
Material:
•
Lead: 42 Alloy; solder plating
•
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
•
CYStek reserves the right to make changes to its products without notice.
•
CYStek
semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
BTN2129T3
CYStek Product Specification
CYSTEKEC [ CYSTECH ELECTONICS CORP. ]
