CYStech Electronics Corp.
TO-92 Taping Outline
H2
H2
H2A H2A
A
D2
Spec. No. : C819A3
Issued Date : 2006.06.06
Revised Date :
Page No. : 4/ 5
H3
L
H4 H
L1
H1
F1F2
D1
D
W1
W
T2
T
T1
P1
P
P2
DIM
A
D
D1
D2
F1,F2
F1,F2
H
H1
H2
H2A
H3
H4
L
L1
P
P1
P2
T
T1
T2
W
W1
-
Item
Component body height
Tape Feed Diameter
Lead Diameter
Component Body Diameter
Component Lead Pitch
F1-F2
Height Of Seating Plane
Feed Hole Location
Front To Rear Deflection
Deflection Left Or Right
Component Height
Feed Hole To Bottom Of Component
Lead Length After Component Removal
Lead Wire Enclosure
Feed Hole Pitch
Center Of Seating Plane Location
4 Feed Hole Pitch
Over All Tape Thickness
Total Taped Package Thickness
Carrier Tape Thickness
Tape Width
Adhesive Tape Width
20 pcs Pitch
Millimeters
Min.
4.33
3.80
0.36
4.33
2.40
-
15.50
8.50
-
-
-
-
-
2.50
12.50
5.95
50.30
-
-
0.36
17.50
5.00
253
Max.
4.83
4.20
0.53
4.83
2.90
±0.3
16.50
9.50
1
1
27
21
11
-
12.90
6.75
51.30
0.55
1.42
0.68
19.00
7.00
255
BTC5706A3
CYStek Product Specification
CYSTEKEC [ CYSTECH ELECTONICS CORP. ]
