CY8C29x66 Final Data Sheet
4. Packaging Information
Figure 4-7. 100-Lead TQFP
51-85048
**
51-85048 *C
4.2
Thermal Impedances
Package
28 PDIP
28 SSOP
28 SOIC
44 TQFP
48 SSOP
48 QFN**
100 TQFP
Typical
Table 4-1. Thermal Impedances per Package
θ
JA
*
69
o
C/W
94
o
C/W
67
o
C/W
60
o
C/W
69
o
C/W
28
o
C/W
50
o
C/W
* T
J
= T
A
+ POWER x
θ
JA
** To achieve the thermal impedance specified for the QFN package, the center
thermal pad should be soldered to the PCB ground plane.
February 15, 2007
Document No. 38-12013 Rev. *H
42