CY8C24223A-24PVXI 参数 Datasheet PDF下载

4.

Packaging Information

This chapter illustrates the packaging specifications for the CY8C24x23A PSoC device, along with the thermal impedances for each

package and the typical package capacitance on crystal pins.

Important Note

Emulation tools may require a larger area on the target PCB than the chip’s footprint. For a detailed description of

the emulation tools’ dimensions, refer to the document titled

PSoC Emulator Pod Dimensions

at

4.1

Packaging Dimensions

51-85075 *A

Figure 4-1. 8-Lead (300-Mil) PDIP

October 17, 2006

Document No. 38-12028 Rev. *F

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