CY7C68013A/CY7C68014A
CY7C68015A/CY7C68016A
Package Diagrams (continued)
TOP VIEW
BOTTOM VIEW
Ø0.05 M C
Ø0.15 M C A B
A1 CORNER
PIN A1 CORNER
Ø0.30 0.05(56X)
1
2
3
4
5
6
6
8
8
7
6
5
4
3
2
1
A
B
C
D
E
A
B
C
D
E
F
F
G
H
G
H
0.50
3.50
-B-
-A-
5.00 0.10
SIDE VIEW
5.00 0.10
0.10(4X)
REFERENCE JEDEC: MO-195C
PACKAGE WEIGHT: 0.02 grams
-C-
SEATING PLANE
001-03901-*B
Figure 12-5. 56 VFBGA (5 x 5 x 1.0 mm) 0.50 Pitch, 0.30 Ball BZ56
PCB Layout Recommendations[24]
• Maintain a solid ground plane under the DPLUS and DMI-
NUS traces. Do not allow the plane to be split under these
traces.
13.0
The following recommendations should be followed to ensure
reliable high-performance operation.
• It is preferred is to have no vias placed on the DPLUS or
DMINUS trace routing.
• At least a four-layer impedance controlled boards are re-
quired to maintain signal quality.
• Isolate the DPLUS and DMINUS traces from all other signal
traces by no less than 10 mm.
• Specify impedance targets (ask your board vendor what
they can achieve).
• To control impedance, maintaintrace widths and trace spac-
ing.
14.0
Quad Flat Package No Leads (QFN)
Package Design Notes
• Minimize stubs to minimize reflected signals.
Electrical contact of the part to the Printed Circuit Board (PCB)
is made by soldering the leads on the bottom surface of the
package to the PCB. Hence, special attention is required to the
heat transfer area below the package to provide a good
thermal bond to the circuit board. A Copper (Cu) fill is to be
designed into the PCB as a thermal pad under the package.
Heat is transferred from the FX2LP through the device’s metal
paddle on the bottom side of the package. Heat from here, is
conducted to the PCB at the thermal pad. It is then conducted
• Connections between the USB connector shell and signal
ground must be done near the USB connector.
• Bypass/flyback caps on VBus, near connector, are recom-
mended.
• DPLUS and DMINUS trace lengths should be kept to within
2 mm of each other in length, with preferred length of
20–30 mm.
Note:
24. Source for recommendations: EZ-USB FX2™PCB Design Recommendations, http://www.cypress.com/cfuploads/support/app_notes/FX2_PCB.pdf and High
Speed USB Platform Design Guidelines, http://www.usb.org/developers/docs/hs_usb_pdg_r1_0.pdf.
Document #: 38-08032 Rev. *K
Page 58 of 60
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