CY2292
Storage Temperature ................................. –65°C to +150°C
Max. Soldering Temperature (10 sec) ......................... 260°C
Junction Temperature.................................................. 150°C
Package Power Dissipation...................................... 750 mW
Maximum Ratings
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Supply Voltage............................................... –0.5V to +7.0V
DC Input Voltage............................................ –0.5V to +7.0V
Static Discharge Voltage.............................................≤ 2000V
(per MIL-STD-883, Method 3015)
Operating Conditions[5]
Parameter
VDD
VDD
TA
Description
Supply Voltage, 5.0V operation
Supply Voltage, 3.3V operation
Part Numbers
Min.
4.5
3.0
0
Max.
5.5
3.6
+70
+85
25
15
25.0
30
Unit
V
V
°C
°C
pF
pF
MHz
MHz
All
All
Commercial Operating Temperature, Ambient
Industrial Operating Temperature, Ambient
Max. Load Capacitance 5.0V Operation
Max. Load Capacitance 3.3V Operation
External Reference Crystal
CY2292/CY2292F
CY2292I/CY2292FI
−40
CLOAD
CLOAD
fREF
All
All
All
All
10.0
1
External Reference Clock[6, 7, 8]
Electrical Characteristics, Commercial 5.0V
Parameter
VOH
VOL
VIH
VIL
IIH
IIL
IOZ
IDD
IDDS
Description
HIGH-Level Output Voltage
LOW-Level Output Voltage
HIGH-Level Input Voltage[9]
LOW-Level Input Voltage[9]
Input HIGH Current
Conditions
IOH = 4.0 mA
IOL = 4.0 mA
Except crystal pins
Except crystal pins
VIN = VDD – 0.5V
VIN = +0.5V
Three-state outputs
VDD = VDD max., 5V operation
Min. Typ. Max. Unit
2.4
V
0.4
V
2.0
V
0.8
10
10
250
100
50
V
<1
<1
µA
µA
µA
mA
µA
Input LOW Current
Output Leakage Current
VDD Supply Current[10] Commercial
75
10
VDD Power Supply Current in Shutdown Mode[10] Shutdown active CY2292/CY2292F
Electrical Characteristics, Commercial 3.3V
Parameter
Description
HIGH-Level Output Voltage
LOW-Level Output Voltage
HIGH-Level Input Voltage[9]
LOW-Level Input Voltage[9]
Input HIGH Current
Conditions
IOH = 4.0 mA
IOL = 4.0 mA
Except crystal pins
Except crystal pins
VIN = VDD – 0.5V
VIN = +0.5V
Three-state outputs
VDD = VDD Max., 3.3V operation
Min. Typ. Max. Unit
VOH
VOL
VIH
VIL
IIH
IIL
IOZ
IDD
2.4
V
0.4
V
2.0
V
0.8
10
10
250
65
50
V
< 1
< 1
µA
µA
µA
mA
µA
Input LOW Current
Output Leakage Current
VDD Supply Current[10] Commercial
50
10
IDDS
VDD Power Supply Current in Shutdown Mode[10] Shutdown active CY2292/CY2292F
Notes:
5. Electrical parameters are guaranteed by design with these operating conditions, unless otherwise noted.
6. External input reference clock must have a duty cycle between 40% and 60%, measured at V /2.
DD
7. Please refer to application note “Crystal Oscillator Topics” for information on AC-coupling the external input reference clock.
8. The oscillator circuit is optimized for a crystal reference and for external reference clocks up to 20 MHz. For external reference clocks above 20 MHz, it is
recommended that a 150Ω pull-up resistor to V be connected to the Xout pin.
DD
9. Xtal inputs have CMOS thresholds.
10. Load = Max., V = 0V or V , Typical (–104) configuration, CPUCLK = 66 MHz. Other configurations will vary. Power can be approximated by the following
IN
DD
formula (multiply by 0.65 for 3V operation): I =10+0.06•(F
DD
+F
+2•F
)+0.27•(F
+F
+F
+F
+F
+F
).
XBUF
CPLL UPLL
SPLL
CLKA
CLKB CLKC CLKD
CPUCLK
Document #: 38-07449 Rev. *B
Page 4 of 11
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