Preliminary Data Sheet
6/30/09
BCM4325
Short Frame Sync, Slave Mode..................................................................................................... 98
Long Frame Sync, Master Mode ................................................................................................... 99
Long Frame Sync, Slave Mode ................................................................................................... 100
FM I2S Timing........................................................................................................................................... 101
FM I2C-Compatible Timing...................................................................................................................... 103
SPROM Timing ......................................................................................................................................... 103
JTAG Timing............................................................................................................................................. 104
SDIO Timing.............................................................................................................................................. 104
Section 22: Power-Up Sequence and Timing................................................................107
SDIO Host Timing Requirement.............................................................................................................. 107
Reset and Regulator Control Signal Sequencing ................................................................................. 107
Signal and Power-up Sequence Timing Diagrams ............................................................................. 108
Section 23: Package Information ...................................................................................113
Package Thermal Characteristics........................................................................................................... 113
Junction Temperature Estimation and PSIjt Versus Thetajc............................................................... 113
Environmental Characteristics ............................................................................................................... 113
Miscellaneous Characteristics................................................................................................................ 114
Section 24: Mechanical Information...............................................................................115
196-Ball FBGA Package........................................................................................................................... 115
339-Pin WLCSP Package......................................................................................................................... 116
Section 25: WLCSP Keepout Area .................................................................................117
Section 26: Ordering Information...................................................................................120
Broadcom Corporation
Document 4325-DS04-R
Page xi
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