FEATURES
IEEE 802.11x Key Features
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Provides IEEE 802.11d, e (WMM, QoS,
WMM-PS), h, i, j (k, r, and w in the future).
Supports IEEE 802.15.2 external 3-wire and
4-wire coexistence schemes to support additional
co-located wireless technologies such as
Bluetooth® GPS, WiMax or UWB.
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Dual band 2.4 GHz and 5 GHz 802.11 a/b/g/n.
Single stream 802.11n support for both 20 MHz
and 40 MHz channels provides PHY layer rates up
to MCS7 (150 Mbps) for typical upper layer
throughput in excess of 70 Mbps.
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Provides an ultra-small form factor solution and
ultralow power consumption to support low-cost
requirements.
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Integrated CMOS power amplifiers deliver greater
than 20 dBm of linear output power
Integrated ARM® Cortex-M3 processor and on-
chip memory for complete WLAN subsystem
functionality minimizing the need to wake up the
applications processor for standard WLAN
functions. This allows for further minimization of
power consumption, while maintaining the
capability to field upgrade with future features.
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Wi-Fi Protected Setup (WPS).
Internal fractional nPLL allows support for a wide
range of reference clock frequencies.
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Worldwide regulatory support: Global products
supported with worldwide homologated design.
USB 2.0 Key Features
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Provides for the following security features:
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WPA™ and WPA2™ (Personal) support for
powerful encryption and authentication
AES and TKIP acceleration hardware for faster
data encryption and 802.11i compatibility
Cisco® Compatible Extension (CCX, CCX 2.0,
CCX 3.0, CCX 4.0) certified
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Support for high speed 480 Mbit/s or full speed
12 Mbit/s operation
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Endpoint management unit
USB 2.0 protocol engine
Separate endpoint packet buffers with a 512-byte
FIFO buffer in each direction
SecureEasySetup™ for simple Wi-Fi® setup
and WPA2/WPA security configuration
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Host-to-device communication for bulk, control,
and interrupt transfers
SDIO Key Features
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Supports standard SDIO V2.0 (4-bit and 1-bit),
and SPI mode
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SDIO clock rates up to 50 MHz
Broadcom Corporation
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Irvine, CA 92617
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