Data Sheet
BCM20706
Bluetooth SoC for Embedded Wireless Devices
GE NE R AL DE S C RI PT ION
The Broadcom
®
BCM20706 is a single-chip Bluetooth
4.1-compliant, embedded SoC with an integrated
baseband processor, a 2.4 GHz transceiver, an ARM
Cortex M3, ROM and RAM, as well as an integrated
Bluetooth stack. Manufactured using an advanced
40 nm CMOS low-power process, the BCM20706
employs high levels of integration reduce external
components, thereby minimizing the device's footprint
and the costs associated with implementing Bluetooth
solutions.
The BCM20706 is the optimal solution for embedded
and IoT applications. Built-in ROM firmware provides
access to both Bluetooth Low Energy (SMART) and
Bluetooth Classic (SMART READY).
A P P LIC AT IO N S
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Home automation
Point-of-sale input devices
Blood pressure monitors
“Find me” devices
Heart rate monitors
Proximity sensors
Thermometers
Wearables
F E A T U RE S
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Up to 96 MHz integrated ARM M3 micro-
controller
Integrated PA with up to +12 dBm output power
Integrated peripherals such as PWM, ADC, Triac
control
Complies with Bluetooth Core Specification
version 4.1 including BR/EDR/BLE
Supports Broadcom proprietary data rates up to 2
Mbps
Supports Adaptive Frequency Hopping (AFH)
Excellent receiver sensitivity
Programmable output power control
On-chip power-on reset (POR)
Support for serial flash interfaces
Integrated low dropout regulators (LDO)
On-chip software controlled power management
unit
PCM/I
2
S Interface
Infrared modulator
IR learning
On-chip support for serial peripheral interface
(master and slave modes)
Broadcom Serial Communications (BSC)
interface (compatible with NXP I
2
C slaves and
MFI authentication co-processor)
Package type:
– 49-pin FBGA Package (4.5 mm x 4.0 mm)
– RoHS compliant
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20706-DS202-R
Corporate Headquarters: San Jose, CA
May 19, 2016
CYPRESS [ CYPRESS SEMICONDUCTOR ]
