EnerChip™ CBC012 Solid State Energy Storage
When placing a silk screen on the PCB around the perimeter of the package, place the silk screen outside of
the package and all metal pads. Failure to observe this precaution can result in package cracking during solder
reflow due to the silk screen material interfering with the solder solidification process during cooling.
Figure 1: Improper PCB traces resulting in an
undesirable parasitic leakage path.
Figure 2: Proper PCB traces, precluding the
formation of a parasitic leakage path.
For the CBC012-D5C the PCB layout of Figure 3 is recommended. Note that there should
not
be a center pad
on the PCB that could contact the exposed die pad on the D5C package. Again, this is to reduce the possible
number and severity of leakage paths between the EnerChip terminals.
Figure 3: Recommended PCB layout to accommodate CBC012 package
Soldering, Rework, and Electrical Test
Refer to the Cymbet User Manual for soldering, rework, and replacement of the EnerChip on printed circuit
boards, and for instructions on in-circuit electrical testing of the EnerChip.
DS-72-02 Rev A
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