CBC012 参数 Datasheet PDF下载

EnerChip™ CBC012 Solid State Energy Storage

Package Dimensions - 6-pin DFN (package code D5)

Pin Number(s)

1

2,3,4,5

6

Description

V-

NIC

V+

Notes:

1. All linear dimensions are in millimeters.

2. Drawing is subject to change without notice.

Note: NIC = No Internal Connection

Printed Circuit Board (PCB) Layout Guidelines and Recommendations

Electrical resistance of solder flux residue on PCBs can be low enough to partially or fully discharge the backup

energy cell and in some cases can be comparable to the load typically imposed on the cell when delivering

power to an integrated circuit in low power mode. Therefore, solder flux must be thoroughly washed from the

board following soldering.

The PCB layout can make this problem worse if the cell’s positive and negative terminals are routed near each

other and under the package, where it is difficult to wash the flux residue away. An undesirable example is

shown in Figure 1. The negative connection on the EnerChip is routed from the negative pad to a via placed

under the package near the positive pad. In this scenario, solder flux residue can wick from the positive solder

pad, covering both the positive pad and the via. This results in a high resistance current path between the

EnerChip terminals. This current path will make the cell appear to be defective or make the application circuit

appear to be drawing too much current.

To avoid this situation, make sure positive and negative traces are routed outside of the package footprint,

as shown in Figure 2, to ensure that flux residue will not cause a discharge path between the positive and

negative pads.

Similarly, a leakage current path can exist from the package lead solder pads to the exposed die pad on the

underside of the package as well as any solder pad on the PCB that would be connected to that exposed die

pad during the reflow solder process. Therefore, it is strongly recommended that the PCB layout not include a

solder pad in the region where the exposed die pad of the package will land. It is sufficient to place PCB solder

pads only where the package leads will be. That region of the PCB where the exposed die pad will land must

not have any solder pads, traces, or vias.

DS-72-02 Rev A

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