CVHD-575
Ultra-Low Phase Noise
VCXO
CVHD-575 Model
5×7.5 mm SMD, 3.3V, HCMOS
0.295 -0.008 +0.035
(7.50 -0.20 +0.89)
RECOMMENDED REFLOW SOLDERING PROFILE
Ramp-Up
Critical
Temperature Zone
3°C/Sec Max.
260°C
Ramp-Down
6°C/Sec.
Part Number
Frequency
Date Code
217°C
0.200 ±0.015
(5.08 ±0.38)
200°C
150°C
0.099
(2.50)
SUGGESTED PAD LAYOUT
via to
ground
0.050
(1.27)
Denotes pad 1
Preheat
180 Secs. Max.
90 Secs. Max.
0.01µF
0.046
(1.16)
8 Minutes Max.
4
1
3
2
260°C for
10 Secs. Max.
0.154
(3.91)
NOTE: Reflow Profile with 240°C peak also acceptable.
0.046
(1.16)
#2
#3
#1
#4
0.058
(1.47)
0.071
(1.80)
0.200
(5.08)
Pad
Connection
0.200
(5.08)
1
2
3
4
Vc
GND
Output
Vdd
PAD FINISH: Immersion Gold (ENIG); 5 micro inches maximum
Mechanical:
Shock: MIL-STD-883, Method 2002, Condition B
Solderability: MIL-STD-883, Method 2003
Vibration: MIL-STD-883, Method 2007, Condition A
Solvent Resistance: MIL-STD-202, Method 215
Resistance to Soldering Heat: MIL-STD-202, Method 210, Condition I or J
Environmental:
Thermal Shock: MIL-STD-883, Method 1011, Condition A
Moisture Resistance: MIL-STD-883, Method 1004
Rev: H
Date: 02-Oct-2017
Page 3 of 3
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Phone: 239-561-3311 • 800-237-3061
CRYSTEK
CORPORATION
Fax: 239-561-1025 • www.crystek.com
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