DataSheet
Panel Mount
ANNEX - ENVIROMENTAL INFORMATION
The environmental information disclosed in this annex including the EIP Pollution logo are in compliance with People’s Republic of China
Electronic Industry Standard SJ/T11364 – 2006, Marking for Control of Pollution Caused by Electronic Information Products.
Part
Name
Toxic or hazardous Substance and Elements
Lead
(Pb)
Mercury
(Hg)
Cadmium
(Cd)
Hexavalent
Chromium
(Cr (VI))
Polybrominated
biphenyls
(PBB)
Polybrominated
diphenyl ethers
(PBDE)
Semiconductor die
Solder
附件 - 环保信息
此附件所标示的包括电子信息产品污染图标的环保信息符合中华人民共和�½电子行业标准 SJ/T11364 - 2006,
电子信息产品污染控制标识要求。
部件
名称
半导�½�芯片
焊接点
铅
(Pb)
汞
(Hg)
镉
(Cd)
有毒有害物质或元素
六价铬
多溴联苯
(Cr (VI))
(PBB)
多溴二苯醚
(PBDE)
50
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