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MPLEZW-A1-0000-0000C030F 参数 Datasheet PDF下载

MPLEZW-A1-0000-0000C030F图片预览
型号: MPLEZW-A1-0000-0000C030F
PDF下载: 下载PDF文件 查看货源
内容描述: 克里?的XLamp ? MP -L EASYWHITE ? LED灯 [Cree? XLamp? MP-L EasyWhite? LEDs]
分类和应用:
文件页数/大小: 14 页 / 789 K
品牌: CREE [ CREE, INC ]
 浏览型号MPLEZW-A1-0000-0000C030F的Datasheet PDF文件第6页浏览型号MPLEZW-A1-0000-0000C030F的Datasheet PDF文件第7页浏览型号MPLEZW-A1-0000-0000C030F的Datasheet PDF文件第8页浏览型号MPLEZW-A1-0000-0000C030F的Datasheet PDF文件第9页浏览型号MPLEZW-A1-0000-0000C030F的Datasheet PDF文件第11页浏览型号MPLEZW-A1-0000-0000C030F的Datasheet PDF文件第12页浏览型号MPLEZW-A1-0000-0000C030F的Datasheet PDF文件第13页浏览型号MPLEZW-A1-0000-0000C030F的Datasheet PDF文件第14页  
XLAMP MP-L EASYWHITE LEDS  
notes  
lꢍꢃꢁꢊ mꢂꢇꢊꢈꢁꢊꢂꢊꢎꢁ Pꢀꢋjꢁꢎꢈꢇꢋꢊꢄ  
Basꢀd on intꢀrnal long-tꢀrm rꢀliability tꢀsting, Crꢀꢀ projꢀcts XLamp MP-L easyWhitꢀ LeDs to maintain a mꢀan 70%  
lumen maintenance after 50,000 hours at maximum rated drive current, provided the LED solder point temperature is  
maintained at or below 85°C.  
Plꢀasꢀ rꢀad thꢀ XLamp Long-Trm Lumꢀn Maintꢀnancꢀ application notꢀ for morꢀ dꢀtails on Crꢀꢀ’s lumꢀn maintꢀnancꢀ  
tꢀsting and forꢀcasting. Plꢀasꢀ rꢀad thꢀ XLamp Thꢀrmal Managꢀmꢀnt application notꢀ for dꢀtails on how thꢀrmal dꢀsign,  
ambiꢀnt tꢀmpꢀraturꢀ, and driꢁꢀ currꢀnt affꢀct thꢀ LeD junction tꢀmpꢀraturꢀ.  
mꢋꢇꢄꢈꢍꢀꢁ sꢁꢊꢄꢇꢈꢇꢐꢇꢈꢅ  
XLamp MP-L easyWhitꢀ LeDs arꢀ shippꢀd in sꢀalꢀd, moisturꢀ-  
mꢂxꢇꢃꢍꢃ Pꢁꢀꢎꢁꢊꢈ rꢁꢉꢂꢈꢇꢐꢁ hꢍꢃꢇꢌꢇꢈꢅ  
tꢁꢃp.  
barrier bags (MBB) designed for long shelf life. If XLamp MP-L  
30% 40% 50% 60% 70% 80% 90%  
easyWhitꢀ LeDs arꢀ ꢀxposꢀd to moist ꢀnꢁironmꢀnts aftꢀr opꢀn-  
ing thꢀ MBB packaging but bꢀforꢀ soldꢀring, damagꢀ to thꢀ  
LeD may occur during thꢀ soldꢀring opꢀration. Thꢀ following  
derating table defines the maximum exposure time (in days)  
for an XLamp MP-L easyWhitꢀ LeD in thꢀ listꢀd humidity and  
35ºC  
30ºC  
25ºC  
20ºC  
-
-
-
-
-
-
-
-
-
-
-
-
17  
28  
-
1
1
2
2
.5  
1
.5  
1
1
1
-
1
1
temperature conditions. LEDs with exposure time longer than the time specified below must be baked according to the  
baking conditions listꢀd bꢀlow.  
Bꢂkꢇꢊꢏ cꢋꢊꢌꢇꢈꢇꢋꢊꢄ  
It is not nꢀcꢀssary to bakꢀ all XLamp MP-L easyWhitꢀ LeDs. Only thꢀ LeDs that mꢀꢀt all of thꢀ following critꢀria must  
be baked:  
1. LeDs that haꢁꢀ bꢀꢀn rꢀmoꢁꢀd from thꢀ original MBB packaging  
2. LeDs that haꢁꢀ bꢀꢀn ꢀxposꢀd to a humid ꢀnꢁironmꢀnt longꢀr than listꢀd in thꢀ Moisturꢀ Sꢀnsitiꢁity sꢀction aboꢁꢀ  
3. LeDs that haꢁꢀ not bꢀꢀn soldꢀrꢀd  
LeDs should bꢀ bakꢀd at 80ºC for 24 hours. LeDs may bꢀ bakꢀd on thꢀ original rꢀꢀls. Rꢀmoꢁꢀ LeDs from MBB packaging  
bꢀforꢀ baking. Do not bakꢀ parts at tꢀmpꢀraturꢀs highꢀr than 80ºC. This baking opꢀration rꢀsꢀts thꢀ ꢀxposurꢀ timꢀ as  
defined in the Moisture Sensitivity section above.  
Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks  
of Cree, Inc.  
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