Maximum Ratings at TA = 25°CNotes 1,2 & 3
DCꢀForwardꢀCurrent
CxxxDA1000-Sxx000
1000ꢀmA
PeakꢀForwardꢀCurrentꢀ(1/10ꢀdutyꢀcycleꢀ@ꢀ1ꢀkHz)
LEDꢀJunctionꢀTemperature
1250ꢀmA
150°C
ReverseꢀVoltage
5ꢀV
OperatingꢀTemperatureꢀRange
StorageꢀTemperatureꢀRange
-40°Cꢀtoꢀ+100°C
-40°Cꢀtoꢀ+100°C
Note 2
Typical Electrical/Optical Characteristics at TA = 25°C, If = 350 mA
Reverse Current
[I(Vr=5V), μA]
Full Width Half Max
Part Number
Forward Voltage (Vf, V)
(λD, nm)
Min.
Typ.
3.15
3.15
Max.
Max.
Typ.
20
C450DA1000-Sxx000
C460DA1000-Sxx000
2.7
2.7
3.5
3.5
2
2
21
Mechanical Specifications
Description
CxxxDA1000-Sxx000
Dimension
Tolerance
±35
P-NꢀJunctionꢀAreaꢀ(μm)
960ꢀxꢀ960
ChipꢀBottomꢀAreaꢀ(μm)
1000ꢀxꢀ1000
±35
ChipꢀTopꢀAreaꢀ(μm)
630ꢀxꢀ630
335
75
±45
ChipꢀThicknessꢀ(μm)
±25
AuSnꢀBondꢀPadꢀWidthꢀ–ꢀAnodeꢀ(um)
AuSnꢀBondꢀPadꢀLengthꢀ–ꢀAnodeꢀ(um)
AuSnꢀBondꢀPadꢀWidthꢀ–ꢀCathodeꢀ(um)
AuSnꢀBondꢀPadꢀLengthꢀ–ꢀCathodeꢀ(um)
BondꢀPadꢀGapꢀ(μm)
±15
945
795
945
75
±35
±35
±35
±15
AuSnꢀBondꢀPadꢀThicknessꢀ(μm)
3
±0.5
Notes:
1.ꢀ Maximumꢀ ratingsꢀ areꢀ package-dependent.ꢀ Theꢀ aboveꢀ ratingsꢀ wereꢀ determinedꢀ usingꢀ aꢀ Creeꢀ 3.45-mmꢀ xꢀ 3.45-mmꢀ SMTꢀ packageꢀ (withꢀ siliconeꢀ
encapsulationꢀ andꢀ intrinsicꢀ AuSnꢀ metalꢀ dieꢀ attach)ꢀ forꢀ characterization.ꢀ Ratingsꢀ forꢀ otherꢀ packagesꢀ mayꢀ differ.ꢀ Junctionꢀ temperatureꢀ shouldꢀ beꢀ
characterizedꢀinꢀaꢀspecificꢀpackageꢀtoꢀdetermineꢀlimitations.ꢀAssemblyꢀprocessingꢀtemperatureꢀmustꢀnotꢀexceedꢀ325°Cꢀ(<ꢀ5ꢀseconds).
2.ꢀ Allꢀproductsꢀconformꢀtoꢀtheꢀlistedꢀminimumꢀandꢀmaximumꢀspecificationsꢀforꢀelectricalꢀandꢀopticalꢀcharacteristicsꢀwhenꢀassembledꢀandꢀoperatedꢀatꢀ350ꢀ
mAꢀwithinꢀtheꢀmaximumꢀratingsꢀshownꢀabove.ꢀEfficiencyꢀdecreasesꢀatꢀhigherꢀcurrents.ꢀTypicalꢀvaluesꢀgivenꢀareꢀwithinꢀtheꢀrangeꢀofꢀaverageꢀvaluesꢀ
expectedꢀbyꢀmanufacturerꢀinꢀlargeꢀquantitiesꢀandꢀareꢀprovidedꢀforꢀinformationꢀonly.ꢀAllꢀmeasurementsꢀwereꢀmadeꢀusingꢀlampsꢀinꢀT-1¾ꢀpackagesꢀ(withꢀ
HysolꢀOS4000ꢀepoxyꢀencapsulantꢀandꢀintrinsicꢀAuSnꢀmetalꢀdieꢀattach).ꢀOpticalꢀcharacteristicsꢀmeasuredꢀinꢀanꢀintegratingꢀsphereꢀusingꢀIlluminanceꢀE.
3.ꢀ TheꢀmaximumꢀforwardꢀcurrentꢀisꢀdeterminedꢀbyꢀtheꢀthermalꢀresistanceꢀbetweenꢀtheꢀLEDꢀjunctionꢀandꢀambient.ꢀItꢀisꢀcrucialꢀforꢀtheꢀend-productꢀtoꢀbeꢀ
designedꢀinꢀaꢀmannerꢀthatꢀminimizesꢀtheꢀthermalꢀresistanceꢀfromꢀtheꢀLEDꢀjunctionꢀtoꢀambientꢀinꢀorderꢀtoꢀoptimizeꢀproductꢀperformance.
1200
1000
800
600
Rth j-a = 10 C/W
Rth j-a = 15 C/W
400
Rth j-a = 20 C/W
Rth j-a = 25 C/W
200
0
25
50
75
100
125
150
175
Ambient Temperature (C)
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703
USA Tel: +1.919.313.5300
www.cree.com
Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the
Cree logo are registered trademarks, and DA and DA1000 are trademarks of Cree, Inc.
2
CPR3ES Rev A
CREE [ CREE, INC ]
