欢迎访问ic37.com |
会员登录 免费注册
发布采购

C450UT190-0312-30 参数 Datasheet PDF下载

C450UT190-0312-30图片预览
型号: C450UT190-0312-30
PDF下载: 下载PDF文件 查看货源
内容描述: 小片190 ×190 X 85单线债券结构 [Small Chip 190 x 190 x 85 Single Wire Bond Structure]
分类和应用:
文件页数/大小: 6 页 / 300 K
品牌: CREE [ CREE, INC ]
 浏览型号C450UT190-0312-30的Datasheet PDF文件第1页浏览型号C450UT190-0312-30的Datasheet PDF文件第3页浏览型号C450UT190-0312-30的Datasheet PDF文件第4页浏览型号C450UT190-0312-30的Datasheet PDF文件第5页浏览型号C450UT190-0312-30的Datasheet PDF文件第6页  
Maximum Ratings at TA = 25°CNotes 1&3  
DCꢀForwardꢀCurrent  
CxxxUT190-Sxxxx-30  
30ꢀmA  
PeakꢀForwardꢀCurrentꢀ(1/10ꢀdutyꢀcycleꢀ@ꢀ1ꢀkHz)  
LEDꢀJunctionꢀTemperature  
100ꢀmA  
125°C  
ReverseꢀVoltage  
5ꢀV  
OperatingꢀTemperatureꢀRange  
-40°Cꢀtoꢀ+100°C  
-40°Cꢀtoꢀ+100°C  
1000ꢀV  
StorageꢀTemperatureꢀRange  
ElectrostaticꢀDischargeꢀThresholdꢀ(HBM)ꢀNoteꢀ2  
ElectrostaticꢀDischargeꢀClassificationꢀ(MIL-STD-883E)ꢀNoteꢀ2  
Classꢀ2  
Note 3  
Typical Electrical/Optical Characteristics at TA = 25°C, If = 5 mA  
Reverse Current  
[I(Vr=5 V), μA]  
Full Width Half Max  
Part Number  
Forward Voltage (Vf, V)  
(λD, nm)  
Min.  
Typ.  
2.9  
2.9  
2.9  
3.0  
Max.  
Max.  
Typ.  
21  
C450UT190-Sxxxx-30  
C460UT190-Sxxxx-30  
C470UT190-Sxxxx-30  
C527UT190-Sxxxx-30  
2.7  
2.7  
2.7  
2.7  
3.1  
3.1  
3.1  
3.2  
2
2
2
2
21  
22  
35  
Mechanical Specifications  
Description  
CxxxUT190-Sxxxx-30  
Dimension  
Tolerance  
±ꢀ25  
P-NꢀJunctionꢀAreaꢀ(μm)  
ChipꢀTopꢀAreaꢀ(μm)  
160ꢀxꢀ160  
190ꢀxꢀ190  
105ꢀxꢀ105  
85  
±ꢀ25  
ChipꢀBottomꢀAreaꢀ(μm)  
ChipꢀThicknessꢀ(μm)  
±ꢀ25  
±ꢀ10  
AuꢀBondꢀPadꢀDiameterꢀ(μm)  
AuꢀBondꢀPadꢀThicknessꢀ(μm)  
BacksideꢀContactꢀMetalꢀAreaꢀ(μm)  
85  
-10/+15  
±ꢀ0.5  
1.2  
80ꢀxꢀ80  
±ꢀ25  
Notes:  
1.ꢀ Maximumꢀ ratingsꢀ areꢀ packageꢀ dependent.ꢀ Theꢀ aboveꢀ ratingsꢀ wereꢀ determinedꢀ usingꢀ aꢀ T-1ꢀ 3/4ꢀ packageꢀ (withꢀ Hysolꢀ OS4000ꢀ  
epoxy)ꢀforꢀcharacterization.ꢀRatingsꢀforꢀotherꢀpackagesꢀmayꢀdiffer.ꢀTheꢀforwardꢀcurrentsꢀ(DCꢀandꢀPeak)ꢀareꢀnotꢀlimitedꢀbyꢀtheꢀdieꢀ  
butꢀbyꢀtheꢀeffectꢀofꢀtheꢀLEDꢀjunctionꢀtemperatureꢀonꢀtheꢀpackage.ꢀTheꢀjunctionꢀtemperatureꢀlimitꢀofꢀ125°CꢀisꢀaꢀlimitꢀofꢀtheꢀT-1ꢀ  
3/4ꢀpackage;ꢀjunctionꢀtemperatureꢀshouldꢀbeꢀcharacterizedꢀinꢀaꢀspecificꢀpackageꢀtoꢀdetermineꢀlimitations.ꢀAssemblyꢀprocessingꢀ  
temperatureꢀmustꢀnotꢀexceedꢀ325°Cꢀ(<ꢀ5ꢀseconds).  
2.ꢀ Productꢀresistanceꢀtoꢀelectrostaticꢀdischargeꢀ(ESD)ꢀaccordingꢀtoꢀtheꢀHBMꢀisꢀmeasuredꢀbyꢀsimulatingꢀESDꢀusingꢀaꢀrapidꢀavalancheꢀ  
energyꢀtestꢀ(RAET).ꢀTheꢀRAETꢀproceduresꢀareꢀdesignedꢀtoꢀapproximateꢀtheꢀminimumꢀESDꢀratingsꢀshown.ꢀTheꢀESDꢀclassificationꢀofꢀ  
Classꢀ2ꢀisꢀbasedꢀonꢀsampleꢀtestingꢀaccordingꢀtoꢀMIL-STD-883E.ꢀ  
3.ꢀ Allꢀproductsꢀconformꢀtoꢀtheꢀlistedꢀminimumꢀandꢀmaximumꢀspecificationsꢀforꢀelectricalꢀandꢀopticalꢀcharacteristicsꢀwhenꢀassembledꢀ  
andoperatedat5mAwithinthemaximumratingsshownabove.Efficiencydecreasesathighercurrents.Typicalvaluesgivenꢀ  
arewithintherangeofaveragevaluesexpectedbymanufacturerinlargequantitiesandareprovidedforinformationonly.Allꢀ  
measurementsꢀwereꢀmadeꢀusingꢀlampsꢀinꢀT-1ꢀ3/4ꢀpackagesꢀ(withꢀHysolꢀOS4000ꢀepoxy).ꢀOpticalꢀcharacteristicsꢀmeasuredꢀinꢀanꢀ  
integratingꢀsphereꢀusingꢀIlluminanceꢀE.  
4.ꢀ Caution:ꢀ Toꢀ obtainꢀ optimumꢀ outputꢀ efficiency,ꢀ theꢀ amountꢀ ofꢀ epoxyꢀ usedꢀ shouldꢀ beꢀ characterizedꢀ basedꢀ uponꢀ theꢀ specificꢀ  
application.ꢀ  
Cree, Inc.  
4600 Silicon Drive  
Copyright © 2011 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the  
Cree logo and G•SiC are registered trademarks, and UltraThin and UT are trademarks of Cree, Inc.  
Durham, NC 27703  
USA Tel: +1.919.313.5300  
www.cree.com  
2
CPR3EO Rev. A