Maximum Ratings at TA = 25°CNotes 1&3
DCꢀForwardꢀCurrentꢀNoteꢀ4
CxxxTR5050-Sxx000
180ꢀmA
PeakꢀForwardꢀCurrentꢀ(1/10ꢀdutyꢀcycleꢀ@ꢀ1ꢀkHz)
LEDꢀJunctionꢀTemperature
230ꢀmA
150°C
ReverseꢀVoltage
5ꢀV
OperatingꢀTemperatureꢀRange
-40°Cꢀtoꢀ+100°C
-40°Cꢀtoꢀ+120°C
≤30°Cꢀ/ꢀ≤85%ꢀRH
1000ꢀV
LEDꢀChipꢀStorageꢀTemperature
RecommendedꢀDieꢀSheetꢀStorageꢀConditions
ElectrostaticꢀDischargeꢀThresholdꢀ(HBM)ꢀNoteꢀ2
ElectrostaticꢀDischargeꢀClassificationꢀ(MIL-STD-883E)ꢀNoteꢀ2
Classꢀ2
Note 3
Typical Electrical/Optical Characteristics at TA = 25°C, If = 120 mA
Reverse Current
[I(Vr=5V), μA]
Full Width Half Max
Part Number
Forward Voltage (Vf, V)
(λD, nm)
Min.
Typ.
3.3
Max.
Max.
Typ.
20
C450TR5050-Sxx000
C460TR5050-Sxx000
2.7
2.7
3.5
3.5
2
2
3.3
21
Mechanical Specifications
Description
CxxxTR5050-Sxx000
Dimension
Tolerance
±35
P-NꢀJunctionꢀAreaꢀ(μm)
ChipꢀAreaꢀ(μm)
426ꢀxꢀ443
500ꢀxꢀ500
175
±35
ChipꢀThicknessꢀ(μm)
±15
AuꢀBondꢀPadꢀDiameterꢀAnodeꢀ(μm)
AuꢀBondꢀPadꢀThicknessesꢀ(μm)
AuꢀBondꢀPadꢀDiamaterꢀCathodeꢀ(μm)
BottomꢀAreaꢀꢀ(μm)
90
±10
1.0
±0.5
±10
98
327ꢀxꢀ327
±35
Notes:
1.ꢀ Maximumꢀratingsꢀareꢀpackage-dependent.ꢀTheꢀaboveꢀratingsꢀwereꢀdeterminedꢀusingꢀlampsꢀinꢀchip-on-MCPCBꢀ(metalꢀcoreꢀPCB)ꢀ
packagesꢀforꢀcharacterization.ꢀRatingsꢀforꢀotherꢀpackagesꢀmayꢀdiffer.ꢀJunctionꢀtemperatureꢀshouldꢀbeꢀcharacterizedꢀinꢀaꢀspecificꢀ
packageꢀtoꢀdetermineꢀlimitations.ꢀAssemblyꢀprocessingꢀtemperatureꢀmustꢀnotꢀexceedꢀ325°Cꢀ(<ꢀ5ꢀseconds).
2.ꢀ Productꢀresistanceꢀtoꢀelectrostaticꢀdischargeꢀ(ESD)ꢀaccordingꢀtoꢀtheꢀHBMꢀisꢀmeasuredꢀbyꢀsimulatingꢀESDꢀusingꢀaꢀrapidꢀavalancheꢀ
energyꢀtestꢀ(RAET).ꢀTheꢀRAETꢀproceduresꢀareꢀdesignedꢀtoꢀapproximateꢀtheꢀmaximumꢀESDꢀratingsꢀshown.
3.ꢀ Allꢀproductsꢀconformꢀtoꢀtheꢀlistedꢀminimumꢀandꢀmaximumꢀspecificationsꢀforꢀelectricalꢀandꢀopticalꢀcharacteristicsꢀwhenꢀassembledꢀ
andꢀoperatedꢀatꢀ120ꢀmAꢀwithinꢀtheꢀmaximumꢀratingsꢀshownꢀabove.ꢀEfficiencyꢀdecreasesꢀatꢀhigherꢀcurrents.ꢀTypicalꢀvaluesꢀgivenꢀ
areꢀwithinꢀtheꢀrangeꢀofꢀaverageꢀvaluesꢀexpectedꢀbyꢀmanufacturerꢀinꢀlargeꢀquantitiesꢀandꢀareꢀprovidedꢀforꢀinformationꢀonly.ꢀAllꢀ
measurementsꢀwereꢀmadeꢀusingꢀlampsꢀinꢀT-1ꢀ3/4ꢀpackagesꢀ(withꢀHysolꢀOS4000ꢀepoxyꢀencapsulantꢀandꢀclearꢀepoxyꢀdieꢀattach).ꢀ
OpticalꢀcharacteristicsꢀmeasuredꢀinꢀanꢀintegratingꢀsphereꢀusingꢀIlluminanceꢀE.
4.ꢀ TheꢀmaximumꢀforwardꢀcurrentꢀisꢀdeterminedꢀbyꢀtheꢀthermalꢀresistanceꢀbetweenꢀtheꢀLEDꢀjunctionꢀandꢀambient.ꢀItꢀisꢀcrucialꢀforꢀ
theꢀend-productꢀtoꢀbeꢀdesignedꢀinꢀaꢀmannerꢀthatꢀminimizesꢀtheꢀthermalꢀresistanceꢀfromꢀtheꢀLEDꢀjunctionꢀtoꢀambientꢀinꢀorderꢀtoꢀ
optimizeꢀproductꢀperformance.
200
180
160
140
120
Rth j-a = 20 °C/W
Rth j-a = 40 °C/W
Rth j-a = 60 °C/W
Rth j-a = 80 °C/W
100
80
60
40
20
0
50
75
100
125
150
175
Ambient Temperature (˚C)
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703-8475 USA
Tel: +1-919-313-5300
Fax: +1-919-313-5870
www.cree.com/chips
Copyright © 2011-2012 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree
and the Cree logo are registered trademarks, and TR and TR5050 are trademarks of Cree, Inc.
2
CPR3ER Rev. A
CREE [ CREE, INC ]
