Maximum Ratings at TA = 25°CNote 1, 2 & 3
DC Forward Current
CxxxEZ950-Sxx000-3-x
1000 mA
Peak Forward Current (1/10 duty cycle @ 1 kHz)
LED Junction Temperature
1500 mA
150°C
Reverse Voltage
5 V
Operating Temperature Range
-40°C to +100°C
-40°C to +120°C
≤30°C / ≤85% RH
LED Chip Storage Temperature Range
Recommended Die Sheet Storage Conditions
Note 2
Typical Electrical/Optical Characteristics at TA = 25°C, If = 350 mA
Reverse Current
[I(Vr=5V), μA]
Full Width Half Max
Part Number
Forward Voltage (Vf, V)
(λD, nm)
Min.
Typ.
3.1
Max.
Max.
Typ.
20
C450EZ950-Sxx000-3-x
C460EZ950-Sxx000-3-x
C470EZ950-Sxx000-3-x
C527EZ950-Sxx000-3-x
2.7
2.7
2.7
2.8
3.4
3.4
3.4
3.8
2
2
2
2
3.1
21
3.1
22
3.25
35
Mechanical Specifications
Description
CxxxEZ950-Sxx000-3-x
Dimensions
Tolerance
± 35
P-N Junction Area (μm)
Chip Area (μm)
900 x 900
930 x 930
170
± 35
Chip Thickness (μm)
± 25
Top Au Bond Pad (μm) - Qty. 2
Au Bond Pad Thickness (μm)
Backside Ohmic Metal Area (μm)
130 x 130
1.0
± 25
± 0.5
± 35
930 x 930
3.0
Backside Ohmic Metal Thickness (μm) – “-A” (AuSn)
Backside Ohmic Metal Thickness (μm) – “-G” (LTDA)
± 1.5
± 1.5
3.3
Notes:
1.
Maximum ratings are package-dependent. The above ratings were determined using a silicone encapsulated chip on MCPCB for
characterization. Ratings for other packages may differ. The junction temperature should be characterized in a specific package
to determine limitations. Assembly processing temperature must not exceed 325°C (< 5 seconds). See the Cree EZBright
Applications Note for assembly-process information.
2.
All products conform to the listed minimum and maximum
specifications for electrical and optical characteristics
1200
when assembled and operated at 350 mA within the
maximum ratings shown above. Efficiency decreases
at higher currents. Typical values given are within the
1000
range of average values expected by the manufacturer in
large quantities and are provided for information only. All
800
measurements were made using a Au-plated TO header
without an encapsulant. Optical characteristics were
measured in an integrating sphere using Illuminance E.
600
Rth j-a = 10 °C/W
Rth j-a = 15 °C/W
Rth j-a = 20 °C/W
Rth j-a = 25 °C/W
3.
The maximum forward current is determined by the
thermal resistance between the LED junction and
ambient. It is crucial for the end-product to be designed
in a manner that minimizes the thermal resistance from
the LED junction to ambient in order to optimize product
performance.
400
200
0
25
50
75
100
125
150
AmbientTemperature (°C)
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703-8475 USA
Tel: +1.919.313.5300
Fax: +1.919.313.5778
www.cree.com
© 2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, the Cree logo,
and EZBright® are registered trademarks, and EZ™ and EZ950™ are trademarks of Cree, Inc.
2
CPR3FW Rev A
CREE [ CREE, INC ]
