Maximum Ratings at TA = 25°CNotes 1,2 & 3
DCꢀForwardꢀCurrent
CxxxDA1000-Sxxx00-2-G
1000ꢀmA
PeakꢀForwardꢀCurrentꢀ(1/10ꢀdutyꢀcycleꢀ@ꢀ1ꢀkHz)
LEDꢀJunctionꢀTemperature
1500ꢀmA
150°C
ReverseꢀVoltage
5ꢀV
OperatingꢀTemperatureꢀRange
LEDꢀChipꢀStorageꢀTemperature
RecommendedꢀDieꢀSheetꢀStorageꢀConditions
-40°Cꢀtoꢀ+100°C
-40°Cꢀtoꢀ+120°C
≤30°Cꢀ/ꢀ≤85%ꢀRH
Note 2
Typical Electrical/Optical Characteristics at TA = 25°C, If = 350 mA
Reverse Current
[I(Vr=5V), μA]
Full Width Half Max
Part Number
Forward Voltage (Vf, V)
(λD, nm)
Min.
Typ.
3.15
3.15
3.15
3.3
Max.
Max.
Typ.
20
C450DA1000-Sxxx00-2-G
C460DA1000-Sxxx00-2-G
C470DA1000-Sxxx00-2-G
C527DA1000-Sxxx00-2-G
2.9
2.9
2.9
3.0
3.4
3.4
3.4
3.6
2
2
2
2
21
22
35
Mechanical Specifications
Description
CxxxDA1000-Sxxx00-2-G
Dimension
Tolerance
±35
P-NꢀJunctionꢀAreaꢀ(μm)
ChipꢀBottomꢀAreaꢀ(μm)
ChipꢀTopꢀAreaꢀ(μm)
960ꢀxꢀ960
1000ꢀxꢀ1000
±35
630ꢀxꢀ630
335
75
±45
ChipꢀThicknessꢀ(μm)
±25
BondꢀPadꢀWidthꢀ–ꢀAnodeꢀ(um)
BondꢀPadꢀLengthꢀ–ꢀAnodeꢀ(um)
BondꢀPadꢀWidthꢀ–ꢀCathodeꢀ(um)
BondꢀPadꢀLengthꢀ–ꢀCathodeꢀ(um)
BondꢀPadꢀGapꢀ(μm)
±15
915
795
890
70
±35
±35
±35
±15
BondꢀPadꢀThicknessꢀ(μm)
3
±0.5
Notes:
1.ꢀ Maximumꢀ ratingsꢀ areꢀ package-dependent.ꢀ Theꢀ aboveꢀ ratingsꢀ wereꢀ determinedꢀ usingꢀ aꢀ Creeꢀ 3.45-mmꢀ xꢀ 3.45-mmꢀ SMTꢀ packageꢀ (withꢀ siliconeꢀ
encapsulationꢀandꢀfluxꢀeutecticꢀdieꢀattach)ꢀforꢀcharacterization.ꢀRatingsꢀforꢀotherꢀpackagesꢀmayꢀdiffer.ꢀJunctionꢀtemperatureꢀshouldꢀbeꢀcharacterizedꢀ
inꢀaꢀspecificꢀpackageꢀtoꢀdetermineꢀlimitations.ꢀAssemblyꢀprocessingꢀtemperatureꢀmustꢀnotꢀexceedꢀ325°Cꢀ(<ꢀ5ꢀseconds).
2.ꢀ Allꢀproductsꢀconformꢀtoꢀtheꢀlistedꢀminimumꢀandꢀmaximumꢀspecificationsꢀ
1200
forꢀelectricalꢀandꢀopticalꢀcharacteristicsꢀwhenꢀassembledꢀandꢀoperatedꢀatꢀ
350ꢀmAꢀwithinꢀtheꢀmaximumꢀratingsꢀshownꢀabove.ꢀEfficiencyꢀdecreasesꢀ
atꢀhigherꢀcurrents.ꢀTypicalꢀvaluesꢀgivenꢀareꢀwithinꢀtheꢀrangeꢀofꢀaverageꢀ
valuesꢀexpectedꢀbyꢀmanufacturerꢀinꢀlargeꢀquantitiesꢀandꢀareꢀprovidedꢀ
1000
forꢀinformationꢀonly.ꢀAllꢀmeasurementsꢀwereꢀmadeꢀusingꢀlampsꢀinꢀT-1¾ꢀ
packagesꢀ(withꢀHysolꢀOS4000ꢀepoxyꢀencapsulantꢀandꢀfluxꢀeutecticꢀdieꢀ
800
attach).ꢀOpticalꢀcharacteristicsꢀmeasuredꢀinꢀanꢀintegratingꢀsphereꢀusingꢀ
IlluminanceꢀE.
600
3.ꢀ Theꢀmaximumꢀforwardꢀcurrentꢀisꢀdeterminedꢀbyꢀtheꢀthermalꢀresistanceꢀ
betweenꢀtheꢀLEDꢀjunctionꢀandꢀambient.ꢀItꢀisꢀcrucialꢀforꢀtheꢀend-productꢀ
toꢀbeꢀdesignedꢀinꢀaꢀmannerꢀthatꢀminimizesꢀtheꢀthermalꢀresistanceꢀfromꢀ
theꢀLEDꢀjunctionꢀtoꢀambientꢀinꢀorderꢀtoꢀoptimizeꢀproductꢀperformance.
Rth j-a = 10 C/W
Rth j-a = 15 C/W
Rth j-a = 20 C/W
400
Rth j-a = 25 C/W
200
0
25
50
75
100
125
150
Ambient Temperature (C)
Cree, Inc.
4600 Silicon Drive
Durham, NC 27703-8475
USA Tel: +1.919.313.5300
Fax: +1.919.313.5870
www.cree.com/chips
© 2014 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree® and the Cree logo
are registered trademarks, and Direct AttachTM, DATM and DA1000™ are trademarks of Cree, Inc.
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CPR3ES Rev C
CREE [ CREE, INC ]
