Environmental Specifications:
• Moisture Resistance per EIA/IS-722 Paragraph 4.4.2. This standard is based upon MIL-STD-202G Method 103B but with temperature and relative
humidity at +85°C and 85% RH respectively. Test condition ‘A’ (240Hr) per MIL-STD-202G.
• Thermal shock: MIL-STD-202, Method 107G, -55°C to 125°C, 30 min. cycle, 10 cycles.
• Vibration: MIL-STD-202F, Method 201A,(10 to 55 to 10 Hz, 1 min. cycle, 2 hrs each in X-Y-Z).
• Chemical resistance: ASTM D-543, 4 hrs @ 40°C, 3 solutions (H2O, detergent solution, defluxer).
• Operating temperature characteristics, measurement at +25°C, +105°C and -56°C.
• Full load voltage: 14.4Vdc, 18Vdc & 24Vdc for 1000 hrs, 25°C.
• Solder leach resistance and terminal adhesion: Per EIA-576.
• Solderability: MIL-STD-202, Method 208 (95% coverage).
Soldering Recommendations
• Compatible with lead and lead-free solder reflow processes
• Peak reflow temperatures and durations:
- IR Reflow = 260°C max for 10 sec. max.
- Wave Solder = 260°C max. for 10 sec. max.
• Recommended IR Reflow Profile:
Dimensions - mm (in)
R
T
H
Recommended Pad Layout - in (mm)
(per IPC-SM-782 )
0.60min
(0.023 min)
1.1 ref
(0.043 ref)
1.0 max
(0.039 max)
ed
nd
e
mm igns
co es
Re
D
ot
t is
N
ew
ar
r N ted P R2
Fo es
g
2-T 4419
ug
DA t #
S
ES ee
03 Sh
06 ta
Da
ee
S
L
W
EIA Size
L
W
H
T
0603ESDA
1.60±0.10
0.80±0.10
0.50±0.10
R
0.70±0.10
0.30±0.20
(0.063±0.004) (0.031±0.004) (0.020±0.004) (0.012±0.008) (0.028±0.004)
Tape and Reel Specifications - mm (in)
4.0±0.1
(.157±.004)
2.0±0.05
(.079±.002)
B
A
3.5±0.05
(.138±.002)
2.0±0.75
(.079±.030)
8.0±0.30
(.315±.012)
4.0±0.1
(.157±.004)
1.5±0.10
(.059±.004)
1.75±0.1
(.069±.004)
2.0±0.5
(.080±.020)
60.0±1.5
(2.362±.059)
178.0±2.0
(7.008±.080)
Dimension
A
B
0603
21±0.8
(.827±.032)
1.90±0.20
(.075±0.008)
1.10±0.20
(.043±0.008)
13.0±0.5
(.512±.020)
9.0±1.5
(.354±.059)
The only controlled copy of this Data Sheet is the electronic read-only version located on the Cooper Bussmann Network Drive. All other copies of this document are by definition uncontrolled. This bulletin is
intended to clearly present comprehensive product data and provide technical information that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change
design or construction of any products and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update, without notice, any technical information con-
tained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applications.
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems without the express written approval of an officer of the Company. Life sup-
port systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result
in significant injury to the user.
© 2012 Cooper Bussmann
St. Louis, MO 63178
www.cooperbussmann.com
1112
BU-SB12920
Page 2 of 2
Data Sheet 4082
COOPER [ COOPER BUSSMANN, INC. ]
