2111 Comprehensive Drive
Aurora, Illinois 60505
Phone: 630- 851- 4722
Fax: 630- 851- 5040
www.conwin.com
CMOS Output Characteristics
Load
Output Voltage:
Vcc = 3.3 Vdc High (Voh)
Low (Vol)
Vcc = 5.0 Vdc High (Voh)
Low (Vol)
Duty Cycle at 50% of Vcc
Rise / Fall Time: 10% to 90%
Parameter
Minimum
-
2.70
-
4.00
-
45
-
Nominal
15
-
-
-
-
50
-
Maximum
-
-
0.30
-
0.50
55
6.5
Units
pF
V
V
V
V
%
ns
Notes
Parameter
Phase Noise Characteristics
Typical Phase Noise for BOC10503F - 010.0M
@ 1 Hz offset
@ 10 Hz offset
@ 100 Hz offset
@ 1 KHz offset
@ 10 KHz offset
@ 100 KHz offset
BOC1 Series Package
Minimum
-
-
-
-
-
-
Nominal
-67
-100
-130
-148
-154
-155
Maximum
-
-
-
-
-
-
dBC/Hz
dBC/Hz
dBC/Hz
dBC/Hz
dBC/Hz
dBC/Hz
Units
Notes
Package Characteristics
Package consisting of a FR4 substrate and a Ryton-R4 cover.
Environmental Characteristics
Shock
500 G’s 1ms, Halfsine, 3 shocks per direction, per MIL-STD 202G, Method 213B Test Condition D.
Sinusoidal Vibration 0.06” D.A. or 10G’s Peak, 10 to 500 Hz, per MIL-STD-202G, Method 204D, Test Condition A.
Random Vibration 5.35 G’s rms. 20 to 2000 Hz per MIL-STD-202G, Method 214,Test Condition 1A, 15 minutes each axis.
Moisture
10 cycles, 95% RH, Per MIL-STD-202G, Method 112.
Marking Permanency
Per MIL-STD-202G, Method 215J.
Solder Process Recommendations: RoHS compliant, lead free. See solder profile on page 6.
In-line
reflow: Refer to recommended reflow pre-heat and reflow temperatures on page 6. Package material
consist of Ryton R-4 high temperature cover with FR4 substrate. Component solder is Pb free high
temperature eutectic alloy with a melting point of 221°C.|
In-line
oven profile: We recommend using KIC profiler or similar device placing one of the thermocouples on the
device to insure that the internal package temperature does not exceed 221°C.
Removal
of device: If for any reason the device needs to be removed from the board, use a temperature controlled
repair station with profile monitoring capabilities. Following a monitored profile will insure the
device is properly pre-heated prior to relow. Refer to IPC 610E for inspection guidelines.
Recommended Cleaning Process: (If required)
Device is non-hermetic, water resistance with four weep holes, one in each corner to allow
moisture to be removed during the drying cycle. We recommend in-line warm water wash
with air knife and drying capabilities. If cleaner does not have drying capability, then use hot air
circulated oven. Boards should be placed in the oven vertically for good water runoff
Device
must be dried properly prior to use!
Note: If saponifier is used make sure the device is rinsed properly to insure all residues are removed. PH of saponifier should
not exceed 10.
Drying
Temperature: Between 85 to 100°C.
Drying
Time: Time will vary depending on the board size.
Caution: Do not submerge the device!
Bulletin
Specifications subject to change without notification. See Connor-Winfield's website for latest revision. Not intended for life support applications.
All dimensions in inches. © Copyright 2013 The Connor-Winfield Corporation
Page
Revision
Date
Cx226
3 of 4
05
22 Nov 2013
CONNOR-WINFIELD [ CONNOR-WINFIELD CORPORATION ]
