CX28394/28395/28398
4.0 Electrical/Mechanical Specifications
Quad/x16/Octal—T1/E1/J1 Framers
4.8 Mechanical Specifications
4.8 Mechanical Specifications
Figure 4-23. 318-Pin Ball Grid Array (BGA)
27.000
24.000
R .500
TYP 3 PL
SEATING
PLANE
18.000
Triangle
Pin #1
.600
± .100
Indicator
2.000 Dia.
TYP 4 PL
(Ejector Pin)
15
˚
.520
.050
.220
±
.070
R 1.7 MM
Engraving
Cavity ID
TOP VIEW
TYP 4 PL
1.414 Chamfer
Optional
1.100
±
2.220
±
24.130
SIDE VIEW
Pin #1
Triangle
12.065
1.270
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
NOTES:
- ALL DIMENSIONS ARE IN MILLIMETERS (MM).
- REFLOW APPLIES TO SOLDERING TO HOST
PC BOARD.
- THERMAL BALLS IN CENTER CONNECTED
TO GROUND.
U
V
W
Y
5 Perimeter Rows
+ 18 Balls (1.27 MM Pitch)
BOTTOM VIEW
100054E
Conexant
4-25
CONEXANT [ CONEXANT SYSTEMS, INC ]
