7.0 Electrical and Mechanical Specifications
CN8478/CN8474A/CN8472A/CN8471A
7.2 Timing and Switching Specifications
Multichannel Synchronous Communications Controller (MUSYCC™)
Figure 7-18. Serial Interface Data Delay Output Waveform
Vth
Vtl
TCLK
Vtest
Tval
Vtest
Vth
Vtl
TDAT
(Rising Edge)
Vtest
Vmax
Vtest
Tval
Vth
Vtl
TDAT
(Falling Edge)
Vtest
Vmax
Vtest
7.2.6 Package Thermal Specification
Table 7-18 lists the package thermal specifications.
Table 7-18. MUSYCC Package Thermal Resistance Characteristics
Airflow–LFM (LMS)
100 (0.505)
Mounting
Conditions
Package
0 (0.000)
50 (0.256)
200 (1.01)
400 (2.03)
Thermal Resistance (junction to ambient) = **C/W
208-BGA
Board-Mounted
Board–Mounted
26
21
22
19
19
17
18
16
17
14
208-Pin Quad
Flat Pack
208-Pin Quad
Flat Pack
Socket
23
21
19
18
16
NOTE(S):
1. LFM–linear feet per minute.
2. LMS–linear meters per second.
3. Junction to case temperature (°C): Tjc = Tac + (θja × Pd) .
Tjc = θja x Pd(measured) + Tac(measured)
Where: Tjc = Junction Temperature (see Table 7-1).
θja = Thermal Resistance (θ-ja, see Table 7-18).
Tac = Ambient Case Temperature (see Table 7-2).
Pd = Power Dissipation = Vdd x Idd (Table 7-1).
7-18
Conexant
100660E