AccessRunner
Controller-less ADSL Modem Device Set for PCI Applications
NOTES:
0.193 0.002
[WITHOUT FLASH]
1. THERMAL HEATSINK/RF GROUND
MATERIAL: OFHC COPPER
-A-
2. LEAD COPLANARITY IS 0.004 MAX.
3. L/F MATERIAL: COPPER 151, 0.0075 THICK
4. LEAD AND HEATSINK FINISH: 85Pb/15 5Sn
5. FLASH IS 0.010 MAX.
-B-
0.154 0.002
[WITHOUT FLASH]
TOP
VIEW
.0001
.0025
1
0.023
PIN 1
0.010 TYP.
VIEW B
SCALE 2:1
0.193 0.002
0.058 0.002
[MOLD]
0.015 X 45
R0.005
(TYP. 4X)
7 (TYP)
0.004
VIEW B
0 -7 TYP.
-C-
VIEW A
0.000
0.004
O.008
TYP.
SEATING PLANE
.174
0.194 0.002
SIDE VIEW
0.024 0.002
MEASURED 0.0098
FROM SEATING PLANE
END VIEW
.110
0.236 0.004
FLASH (TYP)
0.008 MAX.
.005 A
B
VIEW A
SCALE: 100:1
1
UNLESS OTHERWISE SPECIFIED
DIMENSIONS ARE IN INCHES
+0.004
0.010
XXX
.066
-0.002
TOERANCES ON:
M
C
BOTTOM
VIEW
DECIMALS
.XX .03
ANGLES
.XXX .002
0.30
0.025 TYP.
16 LEAD SSOP
PACKAGE OUTLINE
DSL015_010
Figure 10. 16-pin SSOP Package Dimensions
22
Conexant
Proprietary Information
Doc. No. 100394B
October 19, 1999
CONEXANT [ CONEXANT SYSTEMS, INC ]
