MicroTCA Connectors
The interconnection from the MCH and the AMC
modules to the backplane is made by the 170-pin
high speed signal connector. This connector is a
direct mating connector and allows data rates up
to 12.5 Gbps. An additional internal conductive
barrier supplies an additional shielding between
the two signal layers. The connector is designed
with „eye of the needle“ press fit contacts and will
be installed into the systems backplane securely and
without soldering.
The energy will be supplied via power module
output connectors from the PM into the MicroTCA
backplane. This connector is a hybrid connector
with 12 power contact pairs and 72 signal contacts
in a 2.00 mm pitch. The angled version is applied
to the PCB of the power module while the straight
version is designed to be mounted on the system
backplane. Alignment pins on the insulating body
support the guide system of the module and allows
a secured mating.
The current carrying capability is min. 9.3 A and a
power module is able to supply the energy to twelve
AMC Modules.
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CONEC [ CONEC ELEKTRONISCHE BAUELEMENTE GMBH ]
