IXD_604
5.4.3 Tape & Reel Information for SI and SIA Packages
∅1.55 0.05
330.2 DIA.
(13.00 DIA.)
4.00 0.10 See Note #2
1.75 0.10
2.00 0.10
0.30 0.05
B
R0.50 TYP
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
5.50 0.10
(3.40)
B0=5.20 0.10
12.00 0.30
A
A
Embossed Carrier
1.80 0.10
∅1.50 (MIN)
B
8.00 0.10
K0=2.30 0.10
SECTION B-B
A0=6.40 0.10
Embossment
(4.70)
(1.20)
(70º)
NOTES:
1. A0 & B0 measured at 0.3mm above base of pocket.
2. 10 pitches cumulative tol. 0.2mm
3. ( ) Reference dimensions only.
SECTION A-A
4. Unless otherwise specified, all dimensions in millimeters.
5.4.4 PI (8-Pin DIP)
8-0.900 DIA.
(8-0.035 DIA.)
2.540
(0.100)
9.02 / 10.16
(0.355 / 0.400)
0.20 / 0.38
(0.008 / 0.015)
7.50
(0.295)
1.40
(0.055)
6.10 / 6.86
(0.240 / 0.270)
7.62 BSC
(0.300 BSC)
2.540 BSC
(0.100 BSC)
7.37 / 8.26
(0.290 / 0.325)
7.62 / 10.92
(0.300 / 0.430)
PC Board Pattern
3.05 / 3.81
(0.120 / 0.150)
3.43 / 4.70
(0.135 / 0.185)
0.38 / 1.02
(0.015 / 0.040)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
1.14 / 1.65
3.18 / 3.81
(0.125 / 0.150)
(0.045 / 0.065)
0.38 / 0.58
(0.015 / 0.023)
NOTE: Molded package conforms to JEDEC standard configuration
MS-001 variation BA.
12
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