IX2127
3.5 Mechanical Dimensions
3.5.1 8-Pin DIP Through-Hole Package
9.652 0.381
(0.380 0.015)
PCB Hole Pattern
7.620 0.254
(0.300 0.010)
2.540 0.127
(0.100 0.005)
8-0.800 DIA.
2.540 0.127
(8-0.031 DIA.)
(0.100 0.005)
9.144 0.508
(0.360 0.020)
6.350 0.127
(0.250 0.005)
6.350 0.127
(0.250 0.005)
3.302 0.051
(0.130 0.002)
0.457 0.076
(0.018 0.003)
7.620 0.127
(0.300 0.005)
7.239 TYP.
(0.285)
0.254 TYP
(0.01)
7.620 0.127
(0.300 0.005)
4.064 TYP
(0.160)
Dimensions
0.889 0.102
mm
(0.035 0.004)
(inches)
3.5.2 8-Pin SOIC Package
PCB Land Pattern
0.1905 / 0.2489
(0.0075 / 0.0098)
3.810 / 3.988
(0.150 / 0.157)
5.30
(0.209)
5.8014 / 6.1976
(0.2284 / 0.2440)
1.50
(0.059)
0.406 / 1.270
(0.016 / 0.050)
1.372 / 1.575
(0.054 / 0.062)
1.27 TYP
(0.05 TYP)
0.60
(0.024)
0.356 / 0.457
(0.014 / 0.018)
1.27
(0.050)
4.801 / 4.978
(0.189 / 0.196)
0.1016 / 0.2489
(0.0040 / 0.0098)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
0.533 REF
(0.021 REF)
1.524 / 1.727
(0.060 / 0.068)
R02
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