CPC7581
3.3 Tape and Reel Packaging
3.3.1 SOIC
Tape and Reel Packaging for 16-Pin SOIC Package
B0=10.70 + 0.15
(0.421 + 0.01)
330.2 Dia
(13.00 Dia)
Pin 1
Top Cover
Tape Thickness
0.102 Max
W=16.00 + 0.30
(0.630 + 0.010)
(0.004 Max)
Top Cover
Tape
P=12.00
(0.47)
A0=10.90 + 0.15
(0.429 + 0.010)
K0=3.20 + 0.15
(0.193 + 0.01)
K1=2.70 + 0.15
(0.106 + 0.01)
Dimensions
Embossed
Carrier
User Direction of Feed
mm
(inches)
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
Embossment
3.3.2 DFN
B0=7.24 + 0.10
(0.285 + 0.004)
330.2 Dia
(13.00 Dia)
Pin 1
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00 + 0.30
(0.630 + 0.012)
P=12.00 + 0.10
(0.472 + 0.004)
A0=6.24 + 0.10
(0.246 + 0.004)
K0=1.61 + 0.10
(0.063 + 0.004)
Dimensions
mm
(inches)
Embossed
Carrier
User Direction of Feed
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
Embossment
16
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