CPC7581
3. Manufacturing Information
3.1 Mechanical Dimensions
3.1.1 SOIC
NOTES:
10.211 0.254
(0.402 0.010)
1. Coplanarity = 0.1016 (0.004) max.
2. Leadframe thickness does not include solder plating (1000 microinch maximum).
PIN 16
10.312 0.381
(0.406 0.015)
7.493 0.127
(0.295 0.005)
DIMENSIONS
mm
PIN1
(inches)
0.406 0.076
(0.016 0.003)
1.270 TYP
(0.050 TYP)
0.254 MIN / 0.737 MAX X 45°
(0.010 MIN / 0.029 MAX X 45°)
2.540 0.152
(0.100 0.006)
2.337 0.051
(0.092 0.002)
0.649 0.102
(0.026 0.004)
0.203 0.102
(0.008 0.004)
0.889 0.178
(0.035 0.007)
0.2311 MIN / 0.3175 MAX
(0.0091 MIN / 0.0125 MAX)
3.1.2 DFN
7.00 0.ꢀ2
(0.ꢀ76 0.0ꢁ1
6.00 0.ꢀ2
(0.ꢀ36 0.0ꢁ1
INDEX AREA
0.90 0.ꢁ0
(0.032 0.00ꢂ1
TOP VIEW
SIDE VIEW
SEATING
PLANE
0.ꢀ0
(0.0081
0.0ꢀ, + 0.03, - 0.0ꢀ
(0.0008, + 0.00ꢁꢀ, - 0.00081
0.30 0.02
(0.0ꢁꢀ 0.00ꢀ1
EXPOSED
METALLIC PAD
ꢁ
ꢂ.ꢀ2 0.02
(0.ꢁ67 0.00ꢀ1
Terminal Tip
0.80
(0.03ꢀ1
ꢁ6
0.22 0.ꢁ0
(0.0ꢀꢀ 0.00ꢂ1
6.00 0.02
(0.ꢀ36 0.00ꢀ1
BOTTOM VIEW
Dimensions
mm
(inch1
14
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