CPC5712
4. Manufacturing Information
4.1 Mechanical Dimensions and Printed Circuit Board Land Pattern
16-Lead SOP Package
Recommended PCB Land Pattern
0.254 MAX - 0.178 MIN
(0.010 MAX - 0.007 MIN)
4.902 0.102
(0.193 0.004)
0.712 0.051
(0.028 0.002)
3.812 0.076
(0.150 0.003)
5.40
(0.213)
6.045 0.153
(0.238 0.006)
1.55
(0.061)
PIN 1
0.635
(0.025)
0.762 MAX - 0.508 MIN
(0.030 MAX - 0.020 MIN)
0.254 0.051
(0.010 0.002)
0.635
(0.025)
0.40
(0.0157)
0.051 MIN, 0.305 MAX
(0.002 MIN, 0.012 MAX)
1.447 0.076
(0.057 0.003)
Dimensions
mm
(inches)
1.829 MAX
(0.072 MAX)
4.2 Tape and Reel Packaging
Tape and Reel Packaging for 16-Lead SOP Package
330.2 DIA.
(13.00 DIA.)
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
W = 12.00 0.30
(0.472 0.012)
B0 = 5.30 0.10
(0.209 0.004)
Top Cover
Tape
Embossed Carrier
P = 8.00 0.10
(0.315 0.004)
A0 = 6.50 0.10
(0.256 0.004)
Dimensions
mm
(inches)
User Direction of Feed
K0= 2.10 0.10
(0.083 0.004)
Embossment
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
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