9/13
DATA SHEET
8.Soldering
8-1, Lead free soldering
(1) Following soldering paste is recommended
Melting temperature : 216 ~ 220C.
Composition : Sn 3.5Ag 0.75Cu
(2) The temperature profile at the top surface of the parts is recommended as shown below.
(3) It is requested that products should be handled after their temperature has dropped
down to the normal room temperature
4 °C /sec. M a x
260 °C M ax
. M ax
3
sec
4 °C /sec. M ax
220 °C
1 60 ~ 18 0 °C
60 ~ 70sec
14 0sec
T im e
8-2 Recommended soldering pattern
Anode Pad
Mountability and solderability need to be
optimized with actual conditions such as
amount of solder, reflow temperature
applied in the process.
Outline
Center
Cathode Pad
8-3. Recommended pickup nozzle
Shape
Dimension
: Circular
: Diameter more than 1.5mm
8-4. Washing
(1) When washing after soldering is needed, following conditions are requested.
a) Washing solvent: Pure Water
b) Temperature, time: 50C or less × 30 seconds max or 30C or less × 3 minutes max.
Symbol
Name
CITILED
CLL130-0101B2-273M1C5
CITIZEN ELECTRONICS CO.,LTD. JAPAN
Ref.CE-P2209 03/13 R1(1113)
CITIZEN [ CITIZEN ELECTRONICS CO., LTD. ]
