10/13
DATA SHEET
9. Precautions
9-1. Soldering
(1) Lead free soldering
1) Following soldering paste is recommended
Melting temperature : 216 ~ 220C.
Composition : Sn 3.5Ag 0.75Cu
2) The temperature profile at the top surface of the parts is recommended as shown
below.
3) It is requested that products should be handled after their temperature has dropped
down to the normal room temperature
4
/sec. M ax
260
M ax
°C
°C
3
. M ax
sec
4
/sec. M ax
°C
220
°C
160
180
°C
~
60
70sec
~
140sec
Tim e
9-2. Washing
(1) When washing after soldering is needed, following conditions are requested.
a) Washing solvent: Pure Water
b) Temperature, time: 50C or less × 30 seconds max or 30C or less × 3 minutes max.
CITILED
Symbol
Name
CLL130-0101A5-65CM1B3
CITIZEN ELECTRONICS CO.,LTD. JAPAN
Ref.CE-P2161 09/12 R1(11/12)
CITIZEN [ CITIZEN ELECTRONICS CO., LTD. ]
