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DATASHEET
9. Precautions (Continued)
(6) Soldering
-This product is adaptable to reflow process, and please use lead-free soldering.
Following soldering paste is recommended.
Melting temperature : 216 - 220 C.
Composition : Sn-3.5Ag-0.75Cu
-The temperature profile at the top surface of the parts is recommended as shown below.
4
/sec. M a x
2 6 0
M ax
°C
°C
3
. M a x
sec
4
/sec. M a x
°C
2 2 0 °C
1 6 0 ~ 1 8 0 °C
1 4 0 se c
6 0
7 0 sec
~
Tim e
-Next process of soldering should be carried out after the product has return to ambient
temperature.
-Recommemded soldering pattern is shown to the right,
but mountability and solderability need to be optimized
with actual conditions such as amount of solder,
reflow temperature the process.
9) Eye Safety
-The International Electrical Commission (IEC) published in 2006 IEC 62471
”2006 Photobiological safety of lamps and lamp systems ” which includes LEDs within its scope.
-When sorting single LEDs according to IEC 62471, almost all white LEDs can be classified
as belonging to either Exempt Group (no hazard) or Risk Group 1 (low risk).
-However, Optical characteristics of LEDs such as radiant flux,
spectrum and light distribution are factors that affect the risk group determination of the LED,
and especially a high-power LED, that emits light containing blue wavelengths,
might have properties equivalent to those of Risk Group 2 (moderate risk).
-Great care should be taken when directly viewing an LED that is driven at high current,
has multiple uses as a module or when focusing the light with optical instruments,
as these actions might greatly increase the hazard to your eyes.
-It is recommended to regard the evaluation of stand-alone LED packages as a reference
and to evaluate your final product.
Symbol
Name
CITILED
CL-L400-LC1N1-B
CITIZEN ELECTRONICS CO.,LTD. JAPAN
Ref.CE-P2165 10/12