10/12
DATA SHEET
9. Precautions
9-1. Soldering
(1) Lead free soldering
ꢀ1) Following soldering paste is recommended
Melting temperature : 216 ~ 220C.
Composition : Sn 3.5Ag 0.75Cu
ꢀ2) The temperature profile at the top surface of the parts is recommended as shown
below.
ꢀ3) It is requested that products should be handled after their temperature has dropped
down to the normal room temperature
°C
/sec. Max
°C
260 Max
3 . Max
sec
4
°C
/sec. Max
4
220°C
~
160 180
°C
~
60 70sec
140sec
Time
9-2. Washing
(1) When washing after soldering is needed, following conditions are requested.
ꢀa) Washing solvent: Pure Water
ꢀb) Temperature, time: 50C or less × 30 seconds max.
ꢀc) Ultrasonic washing: 300W or less
9-3. Other directions
(1) It is requested to avoid any stress added to the resin portion while it is heated.
(2) It is requested to avoid any friction by sharp metal nail etc. to the resin portion.
CITILED
CL-824-MU1L1
Symbol
Name
CITIZEN ELECTRONICS CO.,LTD. JAPAN
Ref.CE-P1044 04/11
CITIZEN [ CITIZEN ELECTRONICS CO., LTD. ]
