10/11
SPECIFICATIONS
9. Precautions
9-1. Soldering
(1) Lead free soldering
1) Following soldering paste is recommended
Melting temperature: 216 ~ 220C.
ꢀꢀComposition: Sn 3.5Ag 0.75Cu
2) The temperature profile at the top surface of the parts is recommended as shown
ꢀ below.
3) It is requested that products should be handled after their temperature has dropped
ꢀ down to the normal room temperature
4 °C/sec. M ax
260 °C M ax
. M ax
3
sec
4 °C/sec. M ax
220 °C
160 ~ 180 °C
60 ~ 70sec
140sec
Tim e
9-2. Washing
(1) When washing after soldering is needed, following conditions are requested.
a) Washing solvent: Pure Water
b) Temperature, time: 50C or less × 30 seconds max.
or 30C or less × 3 minutes max.
c) Ultrasonic washing: 300W or less
9-3. Other directions
(1) It is requested to avoid any stress added to the resin portion while it is heated.
(2) It is requested to avoid any friction by sharp metal nail etc. to the resin portion.
Approved Checked Drawn
Symbol
Name
CITILED
CL-824-MU1N
Issue of second edition
Issue of first edition
Description Appro.
2009/7/29
2009/3/3
Date
Drawing No
CITIZEN ELECTRONICS CO.,LTD.
Mark
Ref.CE-P482 08/09
CITIZEN [ CITIZEN ELECTRONICS CO., LTD. ]
