CS6422
CS6422
7. PACKAGE DIMENSIONS
20L SOIC (300 MIL BODY) PACKAGE DRAWING
E
H
1
b
c
D
∝
L
SEATING
PLANE
A
e
A1
INCHES
MILLIMETERS
NOM
2.50
DIM
A
A1
b
C
D
E
e
H
L
MIN
0.093
0.004
0.013
0.009
0.496
0.291
0.040
0.394
0.016
0°
NOM
0.098
0.008
0.017
0.011
0.504
0.295
0.050
0.407
0.025
4°
MAX
0.104
0.012
0.020
0.013
0.512
0.299
0.060
0.419
0.050
8°
MIN
2.35
0.10
0.33
0.23
12.60
7.40
1.02
10.00
0.40
0°
MAX
2.65
0.30
0.51
0.32
13.00
7.60
1.52
10.65
1.27
8°
0.20
0.43
0.28
12.80
7.50
1.27
10.34
0.64
∝
4°
JEDEC #: MS-013
Controlling Dimension is Inches/Chip Pac
Controlling Dimension is Millimeters/Jedec
47
47
DS295F1
CIRRUS [ CIRRUS LOGIC ]
