CS4349
11.PACKAGE DIMENSIONS
24L TSSOP (4.4 mm BODY) PACKAGE DRAWING
N
D
E11
A2
A
E
∝
A1
b2
e
L
END VIEW
SEATING
PLANE
SIDE VIEW
1
2 3
TOP VIEW
INCHES
MILLIMETERS
NOTE
DIM
A
MIN
NOM
--
MAX
0.043
0.006
0.037
0.012
0.311
0.256
0.177
--
MIN
--
NOM
--
MAX
1.10
0.15
0.95
0.30
7.90
6.50
4.50
--
--
0.002
0.03346
0.00748
0.303
0.248
0.169
--
A1
A2
b
0.004
0.0354
0.0096
0.307
0.2519
0.1732
0.026 BSC
0.024
4°
0.05
0.85
0.19
7.70
6.30
4.30
--
--
0.90
0.245
7.80
6.40
4.40
0.65 BSC
0.60
4°
2,3
1
D
E
E1
e
1
L
0.020
0°
0.028
8°
0.50
0°
0.70
8°
µ
JEDEC #: MO-153
Controlling Dimension is Millimeters.
1. D” and “E1” are reference datums and do not included mold flash or protrusions, but do include mold
mismatch and are measured at the parting line, mold flash or protrusions shall not exceed 0.20 mm per
side.
2. Dimension “b” does not include dambar protrusion/intrusion. Allowable dambar protrusion shall be
0.13 mm total in excess of “b” dimension at maximum material condition. Dambar intrusion shall not re-
duce dimension “b” by more than 0.07 mm at least material condition.
3. These dimensions apply to the flat section of the lead between 0.10 and 0.25 mm from lead tips.
THERMAL CHARACTERISTICS
Parameters
Package Thermal Resistance
Symbol
Min
Typ
70
105
Max
Units
Single-Layer PCB
Multi-Layer PCB
θ
-
-
°C/Watt
JA
DS782F1
39
CIRRUS [ CIRRUS LOGIC ]
