13 PACKAGE INFORMATION
52L MQFP PACKAGE DRAWING
E
E1
D1
D
1
e
B
∝
A
A1
L
INCHES
NOM
---
MILLIMETERS
NOM
DIM
A
A1
B
D
D1
E
E1
e*
L
∝
MIN
---
0.000
0.009
---
---
---
---
---
MAX
0.096
0.010
0.016
---
---
---
---
---
MIN
---
0.00
0.22
---
---
---
---
---
MAX
2.45
0.25
0.40
---
---
---
---
---
---
---
---
---
---
0.519
0.394
0.519
0.394
0.026
0.035
4°
13.20 BSC
10.00 BSC
13.20 BSC
10.00 BSC
0.65 BSC
0.88
0.029
0.00°
0.041
7.00°
0.73
0.00°
1.03
7.00°
4°
* Nominal pin pitch is 0.65 mm
Controlling dimension is mm.
JEDEC Designation: MS022
13.1 Thermal Characteristics
Parameter
Symbol
Min
Typ
Max
Units
Junction to Ambient Thermal Impedance
2 Layer Board
4 Layer Board
θ
θ
-
-
47
38
-
-
°C/Watt
°C/Watt
JA
JA
DS646PP2
61