8/27/07
CS3014
4. ORDERING INFORMATION
Part #
CS3014-FS
CS3014-FSZ
CS3014-FNZ
*
* Connect thermal die pad to V-.
Temperature Range
-40 °C to +125 °C
-40 °C to +125 °C
-40 °C to +125 °C
Package Description
8-lead SOIC
8-lead SOIC, Lead Free
8-lead QFN, Lead Free
5. ENVIRONMENTAL, MANUFACTURING, & HANDLING INFORMATION
Model Number
CS3014-FS
CS3014-FSZ
CS3014-FNZ
Peak Reflow Temp
240 °C
260 °C
2
365 Days
MSL Rating*
Max Floor Life
* MSL (Moisture Sensitivity Level) as specified by IPC/JEDEC J-STD-020.
6. REVISION HISTORY
Revision
A1
F1
Date
FEB 2007
AUG 2007
First public release.
Updated to “Final” per QPL process.
Changes
8
DS711F1
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