CS3003
4. ORDERING INFORMATION
Part #
CS3003-FS
CS3003-FSZ
CS3003-FNZ
*
* Connect thermal die pad to V-.
Temperature Range
-40 °C to +125 °C
-40 °C to +125 °C
-40 °C to +125 °C
Package Description
8-lead SOIC
8-lead SOIC, Lead Free
8-lead QFN, Lead Free
5. ENVIRONMENTAL, MANUFACTURING, & HANDLING INFORMATION
Model Number
CS3003-FS
CS3003-FSZ
260 °C
CS3003-FNZ
Peak Reflow Temp
240 °C
2
365 Days
MSL Rating*
Max Floor Life
* MSL (Moisture Sensitivity Level) as specified by IPC/JEDEC J-STD-020.
6. REVISION HISTORY
Revision
A0
A1
F1
Date
JAN 2007
FEB 2007
AUG 2007
Initial Release.
Corrected diagram on p1.
Updated to “Final” per QPL process.
Changes
8
DS735F1
CIRRUS [ CIRRUS LOGIC ]
