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CMA17 参数 Datasheet PDF下载

CMA17图片预览
型号: CMA17
PDF下载: 下载PDF文件 查看货源
内容描述: [Operational Amplifier, 17 Func, 5000uV Offset-Max, 0.392 X 0.189 INCH, 0.015 INCH HEIGHT, DIE-69]
分类和应用: 放大器
文件页数/大小: 1 页 / 38 K
品牌: CIRRUS [ CIRRUS LOGIC ]
   
17 CHANNEL HIGH VOLTAGE AMPLIFIER
CMA17
M I C R O T E C H N O L O G Y
HTTP://WWW.APEXMICROTECH.COM
(800) 546-APEX
(800) 546-2739
ABSOLUTE MAXIMUM RATINGS
SUPPLY VOLTAGE, +V
hv
SUPPLY VOLTAGE, V
DD
to V
SS
ESD SUSCEPTIBILITY
2
TEMPERATURE, junction
2
TEMPERATURE, storage
240V
13V
1500V
150°C
–55° to +125°C
NOTE: Because of wafer probe test limitations, full power tests are not possible. Refer to packaged product data sheet MA17 for typical
AC, DC and power performance specifications.
DC WAFER PROBED SPECIFICATIONS
PARAMETER
INPUT (Each Channel)
OFFSET VOLTAGE, initial
BIAS CURRENT, initial
VOLTAGE RANGE
OUTPUT VOLTAGE SWING
LOW VOLTAGE AMPLIFIER
(one/chip)
OFFSET VOLTAGE, initial
POWER SUPPLY
4
VOLTAGE, V
hv
VOLTAGE, V
SS
, V
DD
, total
CURRENT, quiescent V
hv
CURRENT, quiescent V
SS
, V
DD
Full temperature range
Full temperature range
Full temperature range
Full temperature range
±/-15
11.5
±-50
12
TEST CONDITIONS
MIN
TYPICAL
MAX
UNITS
5
100
Full temperature range
V
hv
-V
o
or –V
hv
+ V
o ,
I
O
= 200µA,
Full temp range
5
4.5
6
25
±/-110
12.5
5.5
5
mV
pA
V
V
mV
V
V
mA
mA
NOTES: 1.
2.
3.
4.
V
SS
must be –3.0V to –4.5V. V
DD
must be set to equal 12V V
SS
to V
DD
.
Human-body model, 100pF discharge through a 1.5K ohm resistor.
Unless otherwise noted, all test condtions are the nominal specifications. T
C
= 25°C.
The CMA17 requires three power supplies for unipolar, or four power supplies for bipolar operation. To prevent damage to
the CMA17 or the load the power supply turn on sequence must be followed. V
SS
and V
DD
should be on and stabilized for
100µs prior to turn on of V
hv
.
DIE OUTLINE
1
Vddh
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
Vddh
Vssh
Vssh
SUB
Vss
VddL
Vss
IN1
FB1
IN2
FB2
IN3
FB3
IN4
FB4
IN5
FB5
IN6
FB6
IN7
FB7
IN8
FB8
SUB
Vss
VddL
Vss
IN9 IN10 IN11 IN12 IN13 IN14 IN15 IN16 IN17 LVIN
FB9
FB10 FB11 FB12 FB13 FB14 FB15 FB16 FB17 LVOUT
Die dimensions are 392 x 189 mils x 15 mils thick. Wire bond pads are 5 x 5 mils.
This data sheet has been carefully
APEX MICROTECHNOLOGY
checked and is believed to be reliable, however,
B AUGUST 2002
©
TUCSON,
possible inaccuracies or
omissions.
APPLICATIONS HOTLINE:
change without notice.
CORPORATION
• 5980
CMA17U REV.
no responsibility is assumed
Apex
ARIZONA 85741 USA •
All specifications are subject to
1 (800) 546-2739
NORTH SHANNON ROAD
2002
for
Microtechnology Corp.
84