Package And Order Information
PRELIMINARY DRAFT
Package And Order Information
Package Information
For complete dimensional and thermal information, see the latest version of the Cirrus
Logic Package Information Guide. The package and PCB design affects the amount of
power that can be dissipated by the package and could limit the maximum transfer rate.
29.60 (1.165)
30.40 (1.197)
27.80 (1.094)
28.20 (1.110)
0.17 (0.007)
0.27 (0.011)
27.80 (1.094)
28.20 (1.110)
29.60 (1.165)
30.40 (1.197)
CL-CR3710
208-Pin LQFP
0.50
(0.0197)
BSC
Pin 1 Indicator
Pin 208
Pin 1
1.35 (0.053)
1.45 (0.057)
1.00 (0.039) BSC
0.45 (0.018)
0.75 (0.030)
0.09 (0.004)
0.20 (0.008)
0° MIN
7° MAX
0.05 (0.002)
0.15 (0.006)
1.40 (0.055)
1.60 (0.063)
Note: Dimensions are in millimeters (inches), and controlling dimension is millimeter.
Drawing above does not reflect exact package pin count.
Before beginning any new design with this device, please contact Cirrus Logic for
the latest package information.
CONFIDEN TIAL
DS587PP1 - rev 0.1 April 11, 2002
Copyright 2002 Cirrus Logic Inc.
19
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