CS8120
Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
PACKAGE THERMAL DATA
D
Lead Count
14 Lead SOIC Narrow
8 Lead PDIP
Metric
Max
Min
8.75
8.55
10.16
9.02
English
Max
Min
.344 .337
.400 .355
Thermal Data 5 Lead 5 Lead 8 Lead 14 Lead SOIC
TO-220 D
2
Pak PDIP
Narrow
R
QJC
typ
3.1
3.1
52
30 ûC/W
R
QJA
typ
50
10-50*
100
125 ûC/W
*Depending on thermal properties of substrate. R
Q
JA =
R
QJC
+
R
Q
CA
Plastic DIP (N); 300 mil wide
5 Lead TO-220 (T) Straight
7.11 (.280)
6.10 (.240)
10.54 (.415)
9.78 (.385)
8.26 (.325)
7.62 (.300)
3.68 (.145)
2.92 (.115)
1.77 (.070)
1.14 (.045)
2.54 (.100) BSC
4.83 (.190)
4.06 (.160)
3.96 (.156)
3.71 (.146)
1.40 (.055)
1.14 (.045)
2.87 (.113)
6.55 (.258) 2.62 (.103)
5.94 (.234)
14.99 (.590)
14.22 (.560)
.356 (.014)
.203 (.008)
0.39 (.015)
MIN.
.558 (.022)
.356 (.014)
Some 8 and 16 lead
packages may have
1/2 lead at the end
of the package.
All specs are the same.
14.22 (.560)
13.72 (.540)
REF: JEDEC MS-001
D
Surface Mount Narrow Body (D); 150 mil wide
1.02(.040)
0.63(.025)
6.93(.273)
6.68(.263)
1.02 (.040)
0.76 (.030)
1.83(.072)
1.57(.062)
0.56 (.022)
0.36 (.014)
2.92 (.115)
2.29 (.090)
4.00 (.157)
3.80 (.150)
6.20 (.244)
5.80 (.228)
0.51 (.020)
0.33 (.013)
5 Lead D
2
PAK (DP)
1.27 (.050) BSC
10.31 (.406)
10.05 (.396)
1.40 (.055)
1.14 (.045)
1.68 (.066)
1.40 (.055)
1.75 (.069) MAX
1.57 (.062)
1.37 (.054)
1.27 (.050)
0.40 (.016)
0.25 (.010)
0.19 (.008)
D
REF: JEDEC MS-012
8.53 (.336)
8.28 (.326)
0.25 (0.10)
0.10 (.004)
15.75 (.620)
14.73 (.580)
2.74(.108)
2.49(.098)
0.91 (.036)
0.66 (.026)
2.79 (.110)
2.29 (.090)
Ordering Information
Part Number
CS8120YT5
CS8120YTVA5
CS8120YTHA5
CS8120YN8
CS8120YDP5
CS8120YDPR5
CS8120YD14
CS8120YDR14
Rev. 2/3/98
Description
5 Lead TO-220 Straight
5 Lead TO-220 Vertical
5 Lead TO-220 Horizontal
8 Lead PDIP
5 Lead D
2
PAK
5 Lead D
2
PAK
(tape & reel)
14 Lead SOIC Narrow
14 Lead SOIC Narrow
(tape & reel)
8
1.70 (.067) REF
.254 (.010) REF
4.57 (.180)
4.31 (.170)
0.10 (.004)
0.00 (.000)
Cherry Semiconductor Corporation reserves the
right to make changes to the specifications without
notice. Please contact Cherry Semiconductor
Corporation for the latest available information.
© 1999 Cherry Semiconductor Corporation