CS5651
Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
PACKAGE THERMAL DATA
Lead Count
16 Lead PDIP
16 Lead SO Wide
D
Metric
English
Max
Min
Max Min
19.69
18.67 .775 .735
10.50
10.10 .413 .398
Thermal Data
R
ΘJC
R
ΘJA
typ
typ
16 Lead
PDIP
42
80
16 Lead
SO Wide
23
105
˚C/W
˚C/W
Plastic DIP (N); 300 mil wide
7.11 (.280)
6.10 (.240)
8.26 (.325)
7.62 (.300)
3.68 (.145)
2.92 (.115)
1.77 (.070)
1.14 (.045)
2.54 (.100) BSC
.356 (.014)
.203 (.008)
0.39 (.015)
MIN.
.558 (.022)
.356 (.014)
Some 8 and 16 lead
packages may have
1/2 lead at the end
of the package.
All specs are the same.
REF: JEDEC MS-001
D
Surface Mount Wide Body (DW); 300 mil wide
7.60 (.299)
7.40 (.291)
10.65 (.419)
10.00 (.394)
0.51 (.020)
0.33 (.013)
1.27 (.050) BSC
2.49 (.098)
2.24 (.088)
2.65 (.104)
2.35 (.093)
1.27 (.050)
0.40 (.016)
REF: JEDEC MS-013
0.32 (.013)
0.23 (.009)
D
0.30 (.012)
0.10 (.004)
Ordering Information
Part Number
CS5651GN16
CS5651GDW16
CS5651GDWR16
Rev. 3/9/99
Description
16L PDIP
16L SO Wide
16L SO Wide
(Tape & Reel)
8
Cherry Semiconductor Corporation reserves the
right to make changes to the specifications without
notice. Please contact Cherry Semiconductor
Corporation for the latest available information.
© 1999 Cherry Semiconductor Corporation