Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
PACKAGE THERMAL DATA
16 Lead SOIC Wide
Thermal Data
D
RQJC
RQJA
typ
typ
23
105
ûC/W
ûC/W
Lead Count
Metric
English
Max
Min Max Min
16 Lead SOIC Wide
10.50
10.10 .413 .398
Surface Mount Wide Body (DW); 300mil wide
7.60 (.299)
7.40 (.291)
10.65 (.419)
10.00 (.394)
0.51 (.020)
0.33 (.013)
1.27 (.050) BSC
2.49 (.098)
2.24 (.088)
2.65 (.104)
2.35 (.093)
0.32 (.013)
0.23 (.009)
1.27 (.050)
0.40 (.016)
0.30 (.012)
0.10 (.004)
D
REF: JEDEC MS-013
Ordering Information
Ch erry Sem icon du ctor Corporation reserves th e
righ t to m ake ch an ges to th e specification s with ou t
n otice. Please con tact Ch erry Sem icon du ctor
Corporation for th e latest available in form ation .
Part Number
CS5127GDW16
CS5127GDWR16 16 Lead SOIC Wide (tape & reel)
Description
16 Lead SOIC Wide
Rev. 11/3/98
24
© 1999 Cherry Semiconductor Corporation
CHERRY [ CHERRY SEMICONDUCTOR CORPORATION ]
