CS464
Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
PACKAGE THERMAL DATA
D
Lead Count
16 Lead SO Wide
Metric
Max
Min
10.50 10.10
English
Max Min
.413 .398
Thermal Data
R
QJC
typ
R
QJA
typ
16 Lead SO Wide
23
105
ûC/W
ûC/W
Surface Mount Wide Body (DW); 300 mil wide
7.60 (.299)
7.40 (.291)
10.65 (.419)
10.00 (.394)
0.51 (.020)
0.33 (.013)
1.27 (.050) BSC
2.49 (.098)
2.24 (.088)
2.65 (.104)
2.35 (.093)
1.27 (.050)
0.40 (.016)
REF: JEDEC MS-013
0.32 (.013)
0.23 (.009)
D
0.30 (.012)
0.10 (.004)
Flip-Chip
.350
13X .165
±
.038
1.022
CA
CR
OUT
2.39
.279
MB
CS
.267
.525
±
.05
0
1.020
S
1.022
.496
0
IN+
.356
.431
CS-464
ÊFlip-ChipÊ
IC
.382
Test
0
1.021
.892
.0302 MAX
13X .095
±
.045
IN- Gnd
V
CC
D
1.017
.384
.209
.265
2.14
0
Note: All dimensions in millimeters.
Bump Locations, Bump Side Up
Ordering Information
Part Number
CS464
CS464YDW16
CS464YDWR16
Rev. 3/1/99
Description
Flip-Chip
16 Lead SO Wide
16 Lead SO Wide
(tape & reel)
4
Cherry Semiconductor Corporation reserves the right to
make changes to the specifications without notice. Please
contact Cherry Semiconductor Corporation for the latest
available information.
© 1999 Cherry Semiconductor Corporation
.892
CHERRY [ CHERRY SEMICONDUCTOR CORPORATION ]
