CS4172
Package Specification
PACKAGE DIMENSIONS IN mm (INCHES)
PACKAGE THERMAL DATA
D
Lead Count
16 Lead PDIP
16 Lead SO Wide*
Metric
Max
Min
19.69
18.67
10.50
10.10
English
Max Min
.775 .735
.413 .398
Thermal
Data
R
QJC
typ
R
QJA
typ
16 Lead
PDIP
42
80
16 Lead
SO Wide*
18
75
ûC/W
ûC/W
Plastic DIP (N); 300 mil wide
7.11 (.280)
6.10 (.240)
8.26 (.325)
7.62 (.300)
3.68 (.145)
2.92 (.115)
1.77 (.070)
1.14 (.045)
2.54 (.100) BSC
.356 (.014)
.203 (.008)
0.39 (.015)
MIN.
.558 (.022)
.356 (.014)
Some 8 and 16 lead
packages may have
1/2 lead at the end
of the package.
All specs are the same.
REF: JEDEC MS-001
D
Surface Mount Wide Body (DW); 300 mil wide
7.60 (.299)
7.40 (.291)
10.65 (.419)
10.00 (.394)
0.51 (.020)
0.33 (.013)
1.27 (.050) BSC
2.49 (.098)
2.24 (.088)
2.65 (.104)
2.35 (.093)
1.27 (.050)
0.40 (.016)
REF: JEDEC MS-013
0.32 (.013)
0.23 (.009)
D
0.30 (.012)
0.10 (.004)
Ordering Information
Part Number
CS4172XN16
CS4172XDWF16
CS4172XDWFR16
*Internally Fused Leads
Rev. 4/19/99
Description
16 Lead PDIP
16 Lead SO Wide*
16 Lead SO Wide*
(tape & reel)
Cherry Semiconductor Corporation reserves the right to
make changes to the specifications without notice. Please
contact Cherry Semiconductor Corporation for the latest
available information.
6
© 1999 Cherry Semiconductor Corporation
CHERRY [ CHERRY SEMICONDUCTOR CORPORATION ]
